Three-dimensional maps of grain boundaries and the stress state of individual grains in polycrystals and powders

A fast and non‐destructive method for generating three‐dimensional maps of the grain boundaries in undeformed polycrystals is presented. The method relies on tracking of micro‐focused high‐energy X‐rays. It is verified by comparing an electron microscopy map of the orientations on the 2.5 × 2.5 mm s...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied crystallography Vol. 34; no. 6; pp. 751 - 756
Main Authors: Poulsen, H. F., Nielsen, S. F., Lauridsen, E. M., Schmidt, S., Suter, R. M., Lienert, U., Margulies, L., Lorentzen, T., Juul Jensen, D.
Format: Journal Article
Language:English
Published: 5 Abbey Square, Chester, Cheshire CH1 2HU, England Munksgaard International Publishers 01-12-2001
Blackwell
International Union of Crystallography
Subjects:
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A fast and non‐destructive method for generating three‐dimensional maps of the grain boundaries in undeformed polycrystals is presented. The method relies on tracking of micro‐focused high‐energy X‐rays. It is verified by comparing an electron microscopy map of the orientations on the 2.5 × 2.5 mm surface of an aluminium polycrystal with tracking data produced at the 3DXRD microscope at the European Synchrotron Radiation Facility. The average difference in grain boundary position between the two techniques is 26 µm, comparable with the spatial resolution of the 3DXRD microscope. As another extension of the tracking concept, algorithms for determining the stress state of the individual grains are derived. As a case study, 3DXRD results are presented for the tensile deformation of a copper specimen. The strain tensor for one embedded grain is determined as a function of load. The accuracy on the strain is Δɛ≃ 10−4.
Bibliography:ArticleID:JCRPE0075
ark:/67375/WNG-5T497VF1-M
istex:1CCAB6123B53C9F3CC346FFC1047D1D942766B49
ISSN:1600-5767
0021-8898
1600-5767
DOI:10.1107/S0021889801014273