Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling-Thermohydraulic Performance Enhancement and Fabrication Technology

• Published in: Heat transfer engineering Vol. 25; no. 8; pp. 5 - 16
• Main Authors: KANDLIKAR, SATISH G., GRANDE, WILLIAM J.
• Format: Journal Article
• Language: English
• Published: Philadelphia, PA Taylor & Francis Group 01-12-2004; Taylor & Francis
• Subjects: Applied sciences; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Microelectronic fabrication; Cooling by liquid; Three dimensional flow; Computational fluid dynamics; Pressure drop; Numerical simulation; Thermohydraulics; Printed circuit; Microchannel plates; Microstructure; Heat transfer
• ISSN: 0145-7632; 1521-0537
• DOI: 10.1080/01457630490519772

The increased circuit density on today's computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling with internal flow channels in terms of technological options and challenges. The possibilities presented herein indicate a four- to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel or grooves in the channel surfaces may lead to significant enhancements in single-phase cooling. A simplified and well-established fabrication process is described to fabricate both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process in fabricating complex microstructures within a microchannel.