Package-free infrared micro sensor using polysilicon thermopile

In this paper, a new IR thermal micro sensor using an original design and silicon micro technology is presented. The operating principle of the sensor is based on the Seebeck effect. A high thermoelectric power thermopile has been developed using thermoelectric properties of phosphorus and boron dop...

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Bibliographic Details
Published in:	Sensors and actuators. A. Physical. Vol. 121; no. 1; pp. 52 - 58
Main Authors:	Boutchich, M., Ziouche, K., Yala, M. Ait-Hammouda, Godts, P., Leclercq, D.
Format:	Journal Article
Language:	English
Published:	Elsevier B.V 31-05-2005 Elsevier
Subjects:	Boron Engineering Sciences IR micro sensor Membranes NETD Packaging Phosphorus Polysilicon Sensors Temperature gradient Thermal resistance Thermocouples Thermoelectricity Thermopile Thermopiles Packaging Thermopile Membranes Polysilicon IR micro sensor NETD
Online Access:	Get full text
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