Investigation of Current Flow Between Turns of NI REBCO Pancake Coil by 2-D Finite-Element Method

The no-insulation (NI) winding technique for an NI ReBCO pancake coil is expected to improve dynamic and thermal stability and enhance current density. The investigations on electromagnetic and thermal behaviors are important for the development of NI ReBCO coils. Many stability investigations of th...

Full description

Saved in:

Bibliographic Details
Published in:	IEEE transactions on applied superconductivity Vol. 26; no. 3; pp. 1 - 5
Main Authors:	Noguchi, So, Monma, Katsutoshi, Igarashi, Hajime, Ishiyama, Atsushi
Format:	Journal Article
Language:	English
Published:	New York IEEE 01-04-2016 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:	Behavior Conductivity Copper Current density Electromagnetic simulation Integrated circuit modeling Nickel No-Insulation winding technique Static electricity Substrates Surface resistance turn-to-turn contact surface resistivity no-insulation winding technique NI REBCO pancake coil turn-to-turn contact surface resistivity Electromagnetic simulation
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

Be the first to leave a comment!