Localized electron irradiation methods and their application to detection of flow-field of point defects

We propose new techniques of electron irradiation for studying the kinetics of simple point defects and their agglomeration, by making the most use of the intrinsic function of an ultrahigh-voltage scanning transmission electron microscope. The methods enable us to realize a very high defect product...

Full description

Saved in:
Bibliographic Details
Published in:Journal of electron microscopy Vol. 53; no. 1; pp. 21 - 27
Main Authors: Arai, Shigeo, Satoh, Yuhki, Arakawa, Kazuto, Morita, Chiaki, Kiritani, Michio
Format: Journal Article
Language:English
Published: Japan Oxford University Press 01-01-2004
Oxford Publishing Limited (England)
Subjects:
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:We propose new techniques of electron irradiation for studying the kinetics of simple point defects and their agglomeration, by making the most use of the intrinsic function of an ultrahigh-voltage scanning transmission electron microscope. The methods enable us to realize a very high defect production rate at a localized area and create a spot or band-shape source of point defects. The present methods were applied to an attempt to detect the point defects flowing out of a very localized area, examining the growth and shrinkage of pre-introduced interstitial clusters. At low temperatures where vacancies are immobile, outflow of the interstitials was observed. In contrast, at an elevated temperature where vacancies are mobile, outflow of the vacancies seemed to play a dominant role in the apparent secondary defect reactions. A possible explanation to aid understanding of the present results is proposed.
Bibliography:ark:/67375/HXZ-39KZ2HRW-H
istex:C2F03D86BA3896EDD53DA8F627DDF01E9DDFD0AC
local:dfh010
To whom correspondence should be addressed. E-mail: arai@cirse.nagoya-u.ac.jp
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ObjectType-Article-1
ObjectType-Feature-2
ISSN:0022-0744
1477-9986
2050-5701
DOI:10.1093/jmicro/53.1.21