Sn whisker evaluations in 3D microbumped structures

Sn whiskering remains a reliability concern in electronic applications. Despite extensive research on growth rates and mitigation strategies, no predictive theory is in place. Literature data are available for Cu/Sn-based films and coatings as well as for board-level and flip-chip solder bumps but d...

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Bibliographic Details
Published in:	Microelectronics and reliability Vol. 54; no. 9-10; pp. 1982 - 1987
Main Authors:	Vakanas, G.P., Vandecasteele, B., Schaubroek, D., De Messemaeker, J., Willems, G., Ashworth, M.A., Wilcox, G.D., De Wolf, I.
Format:	Journal Article Conference Proceeding
Language:	English
Published:	Kidlington Elsevier Ltd 01-09-2014 Elsevier
Subjects:	3D/TSV interconnects Applied sciences Copper Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Intermetallics Lead-free solders Mathematical models Microbumping Microelectronic fabrication (materials and surfaces technology) Risk management Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Stacking Testing, measurement, noise and reliability Three dimensional Tin Transistors Whiskers Intermetallics Lead-free solders Microbumping 3D/TSV interconnects Whiskers State of the art Growth rate Stacking Flip-chip Cracking Metallizing Coatings Whisker Integrated circuit bonding Microelectronic fabrication Solder bump Thick film First order Electronic packaging Soldered joint Testing equipment Miniaturization Copper Reliability Static induction transistor Computer aid Figure of merit Reflow soldering
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