Novel High-Q Partially Air-filled Pedestal Resonator and Filter Integrated in a Printed Circuit Board (PCB)

• Published in: IEEE access Vol. 10; p. 1
• Main Authors: Johnson, Leanne, Bouazzaoui, Hassan, Meyer, Elmine, Meyer, Petrie, Potelon, Benjamin, Quendo, Cedric, Allanic, Rozenn
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 2022; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: AFSIW; Circuit boards; Electronics; Engineering Sciences; ESIW; filter; Metals; Micromachining; PCB process; Planar waveguides; Printed circuits; Q factors; Q-factor; Resonant frequency; resonator; Resonator filters; Resonators; SIW; Substrate integrated waveguides; Substrates; Thermal management; thermo-diffusion; Topology
• ISSN: 2169-3536; 2169-3536
• DOI: 10.1109/ACCESS.2022.3208351

In this paper, a resonator and second order filter are fabricated using a novel technological process based on micromachining and thermo-diffusion. The use of this innovative process opens the way to the design of RF components relying on partially air-filled Substrate Integrated Waveguides (SIW). These topologies and particularly the proposed partially air-filled pedestal SIW resonator is suitable to design high-Q, yet compact SIW resonators. In this paper, a study of partially air-filled pedestal SIW resonator is proposed to offer an optimized trade-off between Q-factor and compactness. Then, based on this study, a partially air-filled pedestal resonator working at 5 GHz is designed and manufactured. The measured prototype exhibits a Q-factor of 285, which represents a 53 % increase in Q-factor compared to a fully dielectrically-filled-in pedestal SIW resonator, while the size is kept constant. Finally, a second order filter based on this resonator topology is also designed, measured and discussed.