Technique for 25 nm x-ray nanolithography

The image-forming limit of x-ray lithography is said to be ∼70 nm using existing devices and technologies. This article presents methods to extend the limit to 25 nm or even below. Preparatory to the study, a light source was designed to improve x-ray beam toward shorter wavelength. In addition, a s...

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Published in:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Vol. 19; no. 6; pp. 2428 - 2433
Main Authors: Toyota, Eijiro, Hori, Toshitada, Khan, Mumit, Cerrina, Franco
Format: Conference Proceeding Journal Article
Language:English
Published: 01-11-2001
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Abstract The image-forming limit of x-ray lithography is said to be ∼70 nm using existing devices and technologies. This article presents methods to extend the limit to 25 nm or even below. Preparatory to the study, a light source was designed to improve x-ray beam toward shorter wavelength. In addition, a simulation code has been developed to evaluate the methods. The first method is to use a mask with a larger period and pattern than deigned images. The mask forms the designed images with an enlarged period. Two-dimensional, 25 nm width images can be formed using a 100 nm period pattern mask at 8 μm gap. The second method is to use a mask with interference slits. Since the image pattern is sharply focused, ⩽25 nm images can be formed at 8–12 μm gaps. Multiple exposures are applied to both methods in order to fill in the clearances of the images. Simulation results are shown in both methods for typical patterns.
AbstractList The image-forming limit of x-ray lithography is said to be ∼70 nm using existing devices and technologies. This article presents methods to extend the limit to 25 nm or even below. Preparatory to the study, a light source was designed to improve x-ray beam toward shorter wavelength. In addition, a simulation code has been developed to evaluate the methods. The first method is to use a mask with a larger period and pattern than deigned images. The mask forms the designed images with an enlarged period. Two-dimensional, 25 nm width images can be formed using a 100 nm period pattern mask at 8 μm gap. The second method is to use a mask with interference slits. Since the image pattern is sharply focused, ⩽25 nm images can be formed at 8–12 μm gaps. Multiple exposures are applied to both methods in order to fill in the clearances of the images. Simulation results are shown in both methods for typical patterns.
New methods to extend the limit of proximity x-ray lithography (PXL) to 25 nm or below using negative-phase masks and negative-tone resists are proposed. Use of enlarged pattern masks enables to form [similar to]25 nm two-dimensional features from the normal images at a 8 mu m gap. Interference slit masks provide less than or equal to 25 nm features from the interference images at 8.12 mu m gaps. Both masks can form dense images using multiple exposures.
Author Khan, Mumit
Toyota, Eijiro
Hori, Toshitada
Cerrina, Franco
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  organization: Center for Nano Technology, University of Wisconsin, Stoughton, Wisconsin 53589
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crossref_primary_10_1021_jz3013485
crossref_primary_10_1088_0022_3727_38_16_031
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Smith (r17) 1996; 14
Toyota (r5) 1998; 16
Chu, Smith, Schattenburg (r10) 1991; 59
Toyota (r6) 1999; 38
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Snippet The image-forming limit of x-ray lithography is said to be ∼70 nm using existing devices and technologies. This article presents methods to extend the limit to...
New methods to extend the limit of proximity x-ray lithography (PXL) to 25 nm or below using negative-phase masks and negative-tone resists are proposed. Use...
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StartPage 2428
SubjectTerms Computer simulation
Image quality
Imaging techniques
Light propagation
Light sources
Nanotechnology
Pattern matching
Photoresists
Title Technique for 25 nm x-ray nanolithography
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