Low temperature In–Bi–Zn solder alloy on copper substrate

• Published in: Journal of materials science. Materials in electronics Vol. 27; no. 2; pp. 1408 - 1415
• Main Authors: Noor, Ervina Efzan Mhd, Zuhailawati, H., Radzali, Othman
• Format: Journal Article
• Language: English
• Published: New York Springer US 01-02-2016; Springer Nature B.V
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Contact angle; Copper; Indium base alloys; INTERMETALLIC COMPOUNDS; Materials Science; Melting; Melts; Optical and Electronic Materials; SOLDERING ALLOYS; Solders; Spreading; X RAYS; Solder Alloy; Bulk Solder; Molten Solder; Contact Angle; Differential Scanning Calorimetry
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-015-3904-4

In this paper, characteristic of In–32.7Bi–0.5Zn lead-free solder system have been studied. DSC shows that, In–32.7Bi–0.5Zn system alloy give low melting temperature at 72.30 °C. Lowest melting temperature ensures that the solder melts, forms a joint with the substrates, and re-solidifies within the shortest possible process time. Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for In–32.7Bi–0.5Zn solder alloys were decreasing 30.76° to 24.5° as the temperature increased from 100 to 140 °C. A significant increment of contact angle for In–32.7Bi–0.5Zn at 140 °C. The result of spreading area is inversed with the contact angle. Energy-dispersive X-ray analysis indicated two layer of intermetallic compound between the solder and the substrate; Cu
5
Zn
8
and Cu
11
In
9
compound.