On Change in the Silicon Crystal Structure Implanted with Hydrogen Ions during Annealing Based on Three-Crystal X-Ray Diffractometry Data

In this paper, we present the results of a three-crystal X-ray diffractometry (XRD) study of the state of a disturbed layer formed in silicon crystals by implantation of hydrogen ions with energies of 100 + 200 + 300 keV and a total dose of 2 × 10 16 cm –2 during the subsequent heat exposure in the...

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Bibliographic Details
Published in:Physics of the solid state Vol. 61; no. 8; pp. 1383 - 1388
Main Authors: Asadchikov, V. E., D’yachkova, I. G., Zolotov, D. A., Chukhovskii, F. N., Sorokin, L. M.
Format: Journal Article
Language:English
Published: Moscow Pleiades Publishing 01-08-2019
Springer
Springer Nature B.V
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Summary:In this paper, we present the results of a three-crystal X-ray diffractometry (XRD) study of the state of a disturbed layer formed in silicon crystals by implantation of hydrogen ions with energies of 100 + 200 + 300 keV and a total dose of 2 × 10 16 cm –2 during the subsequent heat exposure in the temperature range from 200 to 1100°C. Here, X-ray studies were performed in the three-crystal XRD scheme when the sample under consideration operates as a second stationary crystal with various fixed angular detuning α from the Bragg position while the third (perfect) crystal-analyzer sweeps the angular distribution of radiation diffracted by the second crystal. Based on a comparison of the shape of diffraction and diffuse maxima for the samples under study, a qualitative conclusion about a significant transformation of radiation defects at post-implantation annealing was derived.
ISSN:1063-7834
1090-6460
DOI:10.1134/S1063783419080079