Infrared semiconductor laser irradiation used for crystallization of silicon thin films

We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20μm. Polycrystalline silicon thin film transistor...

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Bibliographic Details
Published in:Journal of non-crystalline solids Vol. 358; no. 17; pp. 2162 - 2165
Main Authors: Sameshima, T., Hasumi, M.
Format: Journal Article Conference Proceeding
Language:English
Published: Oxford Elsevier B.V 01-09-2012
Elsevier
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Summary:We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20μm. Polycrystalline silicon thin film transistors were fabricated in crystallized regions. The effective electron carrier mobility and threshold voltage were achieved to be 130cm2/Vs and 0.4V, respectively, when the crystalline volume ratio of the silicon films was 0.95. ► Rapid 976-nm semiconductor laser heating was developed for about 20μs. ► 40-nm-thick amorphous silicon films were successfully crystallized. ► A crystalline volume ratio of 0.95 was achieved by the heating for 25μs. ► Polycrystalline thin film transistors were fabricated in the crystallized films. ► The carrier mobility and threshold voltage were achieved to be 130cm2/Vs and 0.4V.
ISSN:0022-3093
1873-4812
DOI:10.1016/j.jnoncrysol.2011.12.030