Separation of film thickness and grain boundary strengthening effects in Al thin films on Si

We have measured stress variations with temperature as a function of film thickness and a given grain size in pure Al and Al–0.5% Cu films on Si substrates. The variation in thickness for a given grain size is brought about by using the same film and the repeated controlled growth and dissolution of...

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Bibliographic Details
Published in:	Journal of materials research Vol. 7; no. 8; pp. 2040 - 2048
Main Authors:	Venkatraman, Ramnath, Bravman, John C.
Format:	Journal Article
Language:	English
Published:	New York, USA Cambridge University Press 01-08-1992 Materials Research Society
Subjects:	Applied sciences Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Metals. Metallurgy Physical properties of thin films, nonelectronic Physics Solid surfaces and solid-solid interfaces Surface energy; thermodynamic properties Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) Thickness Strengthening Mechanical stress Biaxial stress Aluminium Experimental study Thin film Grain boundary
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