Stencil printing process performance on various aperture size and optimization for lead-free solder paste

The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder printing was carried out to evaluate the effect of the filled volume of the solder paste during stencil printing. Application of pressure on...

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Bibliographic Details
Published in:	International journal of advanced manufacturing technology Vol. 102; no. 9-12; pp. 3369 - 3379
Main Authors:	Rusdi, M. S., Abdullah, M. Z., Chellvarajoo, S., Abdul Aziz, M. S., Abdullah, M. K., Rethinasamy, P., Veerasamy, Sivakumar, Santhanasamy, Damian G.
Format:	Journal Article
Language:	English
Published:	London Springer London 01-06-2019 Springer Nature B.V
Subjects:	Apertures CAE) and Design Computer-Aided Engineering (CAD Copper Cost reduction Engineering Industrial and Production Engineering Lead free Load Mechanical Engineering Media Management Optimization Original Article Printing Response surface methodology Separation Silver Solders Tantalum Tin Tin base alloys Transistors Stencil printing Lead-free solder paste Separation speed Squeegee speed Response surface method Squeegee load
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