A physically-based model for quantization effects in hole inversion layers
As MOS devices have been successfully scaled to smaller feature sizes, thinner gate oxides and higher levels of channel doping have been used in order to simultaneously satisfy the need for high drive currents and minimal short-channel effects. With the onset and development of deep submicron (/spl...
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Published in: | IEEE transactions on electron devices Vol. 45; no. 1; pp. 179 - 186 |
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01-01-1998
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Abstract | As MOS devices have been successfully scaled to smaller feature sizes, thinner gate oxides and higher levels of channel doping have been used in order to simultaneously satisfy the need for high drive currents and minimal short-channel effects. With the onset and development of deep submicron (/spl les/0.25 /spl mu/m gate length) technology, the combination of the extremely thin gate oxides (t/sub ox//spl les/10 nm) and high channel doping levels (/spl ges/10/sup 17/ cm/sup -3/) results in transverse electric fields at the Si/SiO/sub 2/ interface that are sufficiently large, even near threshold, to quantize the motion of inversion layer carriers near the interface. The effects of quantization are well known and begin to impact the electrical characteristics of the deep submicron devices at room temperature when compared to the traditional classical predictions which do not take into account these quantum mechanical (QM) effects. For accurate device simulations, quantization effects must be properly accounted for in today's widely used moment-based device simulators. This paper describes a new computationally efficient three-subband model that predicts the effects of quantization on the terminal characteristics in addition to the spatial distribution of holes within the inversion layer. The predictions of this newly developed model agree very well with both the predictions of a self-consistent Schrodinger-Poisson solver and experimental measurements of QM effects in MOS devices. |
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AbstractList | As MOS devices have been successfully scaled to smaller feature sizes, thinner gate oxides and higher levels of channel doping have been used in order to simultaneously satisfy the need for high drive currents and minimal short-channel effects. With the onset and development of deep submicron ( 0.25 mum gate length) technology, the combination of the extremely thin gate oxides (t(ox) 10 nm) and high channel doping levels ( 10(17) cm(-3)) results in transverse electric fields at the Si/SiO(2) interface that are sufficiently large, even near threshold, to quantize the motion of inversion layer carriers near the interface. The effects of quantization are well known and begin to impact the electrical characteristics of the deep submicron devices at room temperature when compared to the traditional classical predictions which do not take into account these quantum mechanical (QM) effects. For accurate device simulations, quantization effects must be properly accounted for in today's widely used moment-based device simulators. This paper describes a new computationally efficient three-subband model that predicts the effects of quantization on the terminal characteristics in addition to the spatial distribution of holes within the inversion layer. The predictions of this newly developed model agree very well with both the predictions of a self-consistent Schrodinger-Poisson solver and experimental measurements of QM effects in MOS devices As MOS devices have been successfully scaled to smaller feature sizes, thinner gate oxides and higher levels of channel doping have been used in order to simultaneously satisfy the need for high drive currents and minimal short-channel effects. With the onset and development of deep submicron ( less than or equal to 0.25 mu m gate length) technology, the combination of the extremely thin gate oxides (t sub(ox) less than or equal to 10 nm) and high channel doping levels ( greater than or equal to 10 super(17) cm super(-3)) results in transverse electric fields at the Si/SiO sub(2) interface that are sufficiently large, even near threshold, to quantize the motion of inversion layer carriers near the interface. The effects of quantization are well known and begin to impact the electrical characteristics of the deep submicron devices at room temperature when compared to the traditional classical predictions which do not take into account these quantum mechanical (QM) effects. For accurate device simulations, quantization effects must be properly accounted for in today's widely used moment-based device simulators. This paper describes a new computationally efficient three-subband model that predicts the effects of quantization on the terminal characteristics in addition to the spatial distribution of holes within the inversion layer. The predictions of this newly developed model agree very well with both the predictions of a self-consistent Schrodinger-Poisson solver and experimental measurements of QM effects in MOS devices. As MOS devices have been successfully scaled to smaller feature sizes, thinner gate oxides and higher levels of channel doping have been used in order to simultaneously satisfy the need for high drive currents and minimal short-channel effects. With the onset and development of deep submicron (/spl les/0.25 /spl mu/m gate length) technology, the combination of the extremely thin gate oxides (t/sub ox//spl les/10 nm) and high channel doping levels (/spl ges/10/sup 17/ cm/sup -3/) results in transverse electric fields at the Si/SiO/sub 2/ interface that are sufficiently large, even near threshold, to quantize the motion of inversion layer carriers near the interface. The effects of quantization are well known and begin to impact the electrical characteristics of the deep submicron devices at room temperature when compared to the traditional classical predictions which do not take into account these quantum mechanical (QM) effects. For accurate device simulations, quantization effects must be properly accounted for in today's widely used moment-based device simulators. This paper describes a new computationally efficient three-subband model that predicts the effects of quantization on the terminal characteristics in addition to the spatial distribution of holes within the inversion layer. The predictions of this newly developed model agree very well with both the predictions of a self-consistent Schrodinger-Poisson solver and experimental measurements of QM effects in MOS devices. |
Author | Maziar, C.M. Hareland, S.A. Chindalore, G.L. Jallepalli, S. Haihong Wang Tasch, A.F. Wei-Kai Shih |
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References | ref15 ref14 jallepalli (ref9) 1996 pinto (ref12) 1986 ref11 ref10 ref2 ref1 ref17 selberherr (ref13) 1980; 27 ref16 ref18 ref7 ref4 hu (ref6) 1996; 17 ref3 ref5 jallepalli (ref8) 1996 |
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SubjectTerms | Computational modeling Distributed computing Doping Electric variables MOS devices Predictive models Quantization Quantum mechanics Semiconductor process modeling Temperature |
Title | A physically-based model for quantization effects in hole inversion layers |
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