Thermal Management Challenges in Telecommunication Systems and Data Centers

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 2; no. 8; pp. 1307 - 1316
• Main Authors: Garimella, S. V., Lian-Tuu Yeh, Persoons, T.
• Format: Journal Article
• Language: English
• Published: Piscataway, NJ IEEE 01-08-2012; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Central office; communication networks; Computer centers; Cooling; Data centers; Design engineering; Design. Technologies. Operation analysis. Testing; Electric communication systems; Electronics; Energy consumption; energy management; Exact sciences and technology; Heat recovery; Integrated circuits; Modularity; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Space heating; Sustainability; Telecommunications; Telecommunications industry; Telecommunications systems; Thermal management; thermal management of electronics; Waste heat; Cooling by liquid; Thermal management (packaging); communication networks; Thermal behavior; System design; Sustainable development; Addressing; Implementation; Central office; Telecommunication system; Telecommunication network; Cooling system; Electric power consumption; thermal management of electronics; Reliability; Energy management
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2012.2185797

The framework for this paper is the growing concern about the worldwide increasing energy consumption of telecommunications systems and data centers, and particularly the contribution of the thermal management system. The present energy usage of these systems is discussed, as well as the relationship between cooling system design and the total cost of ownership. This paper identifies immediate and future thermal bottlenecks facing the industry, ranging from technological issues at the component and system level to more general needs involving reliability, modularity, and multidisciplinary design. Based on this enumeration, the main challenges to implementing cooling solutions are reviewed. Particular attention is paid to implementing liquid cooling, since this technology seems the most promising to addressing the key thermal bottlenecks, and improving the future sustainability of thermal management in the telecom and data center industry. Finally, an outlook is presented toward future potential challenges.