Micromechanical BEoL robustness evaluation methods enabling loading condition customization and acoustic emission damage monitoring

• Published in: MethodsX Vol. 10; p. 102028
• Main Authors: Silomon, Jendrik, Chimeg, Dulguun, Clausner, André, Zschech, Ehrenfried
• Format: Journal Article
• Language: English
• Published: Netherlands Elsevier B.V 01-01-2023; Elsevier
• Subjects: Cu-pillar tensile stress testing; Flexible customization of micromechanical load induction to individual electrical microchip connectors for BEoL robustness evaluation; Individual Cu-pillar soldering; Method; Sub-critical BEoL damage induction and analysis; Sub-critical BEoL damage induction and analysis; Flexible customization of micromechanical load induction to individual electrical microchip connectors for BEoL robustness evaluation; Cu-pillar tensile stress testing; Individual Cu-pillar soldering
• ISSN: 2215-0161; 2215-0161
• DOI: 10.1016/j.mex.2023.102028

For micromechanical robustness evaluation methods, it is advantageous if the mechanical loading conditions applied can be controlled as precisely as possible. For microchips, this is required to determine the robustness under specific conditions, e.g. during assembly or characteristic application/usage scenarios. In this work, three different micromechanical BEoL (Back End of Line) robustness evaluation methods are presented which should enable a more precise and flexible mechanical load induction and damage identification. They have been subsequently developed. Three main aspects characterize the customization of the developed approaches:•The design and testing of customized micro-tools to precisely apply mechanical load to individual Cu-pillars.•The implementation of an AE (Acoustic Emission) monitoring approach to detect minor damages during mechanical loading. This strategy also enabled the development of sub-critical loading experiments for which AE signals served as a damage indicator and mechanical loading was aborted upon the detection of AE events.•The development of a new measurement setup and approach to enable the solder attach of individual Cu-pillars to a mechanical testing system.
The applications of these approaches should enable the induction of customized mechanical loading conditions and the identification of failure modes and damage initiation locations.
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