Direct writing of copper conductive patterns by ink-jet printing

• Published in: Thin solid films Vol. 515; no. 19; pp. 7706 - 7711
• Main Authors: Park, Bong Kyun, Kim, Dongjo, Jeong, Sunho, Moon, Jooho, Kim, Jang Sub
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Lausanne Elsevier B.V 16-07-2007; Elsevier Science
• Subjects: Applied sciences; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Conductive pattern; Copper nanoparticle; Cross-disciplinary physics: materials science; rheology; Electrical properties of specific thin films; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronics; Exact sciences and technology; Ink-jet; Materials science; Methods of nanofabrication; Microelectronic fabrication (materials and surfaces technology); Nanoscale pattern formation; Physical properties of thin films, nonelectronic; Physics; Printing; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thermal stability; thermal effects; Printing; Conductive pattern; Copper nanoparticle; Ink-jet; Viscosity; Gold; Inkjet; Particle size; Patterning; Electrical conductivity; Thin films; Direct method; Nanoparticles; Silver; Microelectronic fabrication; Manufacturing processes; Ink jet printers; Thermal conductivity; Copper; Nanostructured materials
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/j.tsf.2006.11.142

Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.