Reduction of electron beam drift caused by deflecting electrode by downflow cleaning process

• Published in: Japanese Journal of Applied Physics Vol. 34; no. 12B; pp. 6655 - 6657
• Main Authors: OGASAWARA, M, OHTOSHI, K, SUGIHARA, K
• Format: Conference Proceeding Journal Article
• Language: English
• Published: Tokyo Japanese journal of applied physics 1995
• Subjects: Applied sciences; Electronics; Exact sciences and technology; Microelectronic fabrication (materials and surfaces technology); Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Downward flow; Electron beam lithography; Electron gun; Electron beam; Electron optics; Cleaning; Experimental study; Electrodes; Microelectronic fabrication; Beam deflection; Deflector; Deflection of the vertical; Reliability; Electrostatics
• ISSN: 0021-4922; 1347-4065
• DOI: 10.1143/JJAP.34.6655

We studied the electron beam drift caused by charging up of deflector electrode surfaces oxidized by a dry cleaning process used to remove the contamination layer. The process adopted was a downflow ashing process with a mixture of CF
4
and oxygen as a source gas. It was found that even a gold surface is oxidized and suffers from charging up after the cleaning process. It was also found that such a gold oxide layer can be removed by a postprocessing with nitrogen radicals, and that the charging up is reduced. However, when the surface is nickel, the nitrogen postprocess does not remove the oxide layer, leaving large beam drift.