Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection

We propose pyramid bumps as one of the compliant bumps for realizing stacked chips with fine-pitch chip interconnections. The pyramid bumps, made of Au, are fabricated by the bump transfer method. The bump size is approximately 13 µm at the base and pitch is 20 µm. A comparative study between the py...

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Bibliographic Details

Published in:	Japanese Journal of Applied Physics Vol. 44; no. 4S; p. 2751
Main Authors:	Watanabe, Naoya, Ootani, Youhei, Asano, Tanemasa
Format:	Journal Article
Language:	English
Published:	01-04-2005
Online Access:	Get full text
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