XPS Study on the Weakest Zone in the Adhesion Structure between Resin Containing 4-META and Precious Metal Alloys Treated with Different Surface Modification Methods

• Published in: Dental Materials Journal Vol. 20; no. 1; pp. 90 - 102
• Main Authors: OHNO, Hiroki, ENDO, Kazuhiko, YAMANE, Yuro, KAWASHIMA, Isao
• Format: Journal Article
• Language: English
• Published: Japan The Japanese Society for Dental Materials and Devices 2001
• Subjects: Acrylic Resins - chemistry; Adhesiveness; Boron Compounds - chemistry; Dental Alloys - chemistry; Dental Bonding; Dentin-Bonding Agents - chemistry; Dentistry; Electron Probe Microanalysis; Electroplating; Gold Alloys - chemistry; Materials Testing; Methacrylates - chemistry; Methylmethacrylates - chemistry; Oxidation-Reduction; Precious metal alloys; Resin bonding; Resin Cements - chemistry; Silanes - chemistry; Silver - chemistry; Surface modification; Surface Properties; Surface-Active Agents - chemistry; Triazines - chemistry; Water - chemistry
• ISSN: 0287-4547; 1881-1361
• DOI: 10.4012/dmj.20.90

Three precious metal alloys, Type IV gold alloy, 14K gold alloy, and silver-based alloy, were treated with different surface modifications including a metal primer (VBATDT) application, a SiOX coating method, high-temperature oxidation, modification method with a liquid Ga-Sn alloy, and tin electroplating. Then thin PMMA films were bonded with a resin containing 4-META. Water durability at the adhesion interface was evaluated after water immersion, followed by thermal cycling used liquid nitrogen. The weakest zone at the interface was investigated using XPS only for the Ag-Pd alloy specimens that had been surface-treated with aspolishing, adhesive primer, and the SiOX coating method, since peeling of the PMMA film on the surface of specimens surface-treated by other methods was not observed. Metal elements were detected from the resin side at the adhesion interface. The chemical states of Cu in the resin before argon ion etching were characterized as metal oxides and/or states of chemical interaction with 4-META, VBATDT, or SiOX.