Investigate the influence of bonding temperature in transient liquid phase bonding of SiC and copper

• Published in: Ceramics international Vol. 43; no. 10; pp. 7762 - 7767
• Main Authors: Hynes, N. Rajesh Jesudoss, Velu, P. Shenbaga, Kumar, R., Raja, M. Karthick
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01-07-2017
• Subjects: Bonding temperature; Dissimilar materials; Mechanical properties; Scanning Electron microscopy; Transient Liquid Phase (TLP) Bonding; Mechanical properties; Bonding temperature; Dissimilar materials; Transient Liquid Phase (TLP) Bonding; Scanning Electron microscopy
• ISSN: 0272-8842; 1873-3956
• DOI: 10.1016/j.ceramint.2017.03.084

Joining of ceramics to metals provide timeless challenges in nuclear engineering industries. There is a pressing need for developing a suitable technique for joining silicon carbide (absorber) to copper radio frequency structures in Compact Linear Collider. Transient liquid phase bonding is a promising candidate that could be employed for joining of dissimilar materials with high re-melt temperature. In the present work, experiments were carried out on Transient Liquid phase bonding of silicon carbide and copper using metal interlayer. Lead, which has high wettability, is selected as an interlayer in the Transient Liquid Phase (TLP) bonding process. Experimental results of mechanical testing reveal the strength of the SiC/Cu joints and its integrity. Since, the bonding temperature is the most important parameter to achieve sound joint with good mechanical properties, its influence is studied through experimental trials. From the experimental studies, it is found that the bonding temperature should be 230°C to obtain the good quality SiC/Copper joints.Favorable temperature distribution is achieved at this bonding temperature and consequently, the joining efficiency of SiC/Copper joints is increased..