Reflectance Measurements of Annealed Porous Silicon Implanted with Nitrogen by Plasma Immersion Ion Implantation

Porous silicon (PS) samples, approximately 1 μm thick, were obtained from p‐ and n‐type (100) monocrystalline silicon wafers using different anodization conditions and were implanted with nitrogen by plasma immersion ion implantation (PIII). For comparison, polished silicon samples were implanted as...

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Bibliographic Details
Published in:Physica status solidi. B. Basic research Vol. 232; no. 1; pp. 111 - 115
Main Authors: Beloto, A.F., Silva, M.D., Senna, J.R., Kuranaga, C., Leite, N.F., Ueda, M.
Format: Journal Article Conference Proceeding
Language:English
Published: Berlin WILEY-VCH Verlag Berlin GmbH 01-07-2002
WILEY‐VCH Verlag Berlin GmbH
Wiley
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Summary:Porous silicon (PS) samples, approximately 1 μm thick, were obtained from p‐ and n‐type (100) monocrystalline silicon wafers using different anodization conditions and were implanted with nitrogen by plasma immersion ion implantation (PIII). For comparison, polished silicon samples were implanted as well as the PS samples. The effects of implantation and of the compounds formed (SiO2 and Si3N4) on the reflectance were analyzed. Reflectance measurements of the implanted samples were carried out before and after PIII, and after annealing (1000 °C, 30 min in N2) and etching in an 8% (w/w) HF solution for 8 min. After implantation, a reduction of the reflectance in the ultraviolet (UV) region of the spectrum was observed for the polished silicon samples. All the PS samples had strong photoluminescence (PL) before and after PIII and small changes were observed in the reflectance. After annealing, the PS samples showed an increase of the reflectance in the UV region and no PL.
Bibliography:ark:/67375/WNG-JWVJFGN0-F
istex:ED1B5C3AEA81C027E8B539C6881E72BF6913C85E
ArticleID:PSSB111
ISSN:0370-1972
1521-3951
DOI:10.1002/1521-3951(200207)232:1<111::AID-PSSB111>3.0.CO;2-L