AlGaAs/GaAs HBTs for 10-Gb/s ICs using a new base ohmic contact fabrication process

A new basic ohmic contact technology for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is presented. The effect of the device parameters on the high-frequency performance of HBT ICs for 10-Gb/s systems is analyzed, and it is shown that, at a cutoff frequency (f/sub T/) of 40 GHz or more, red...

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Published in:IEEE transactions on electron devices Vol. 40; no. 1; pp. 25 - 31
Main Authors: Kusano, C., Masuda, H., Mochizuki, K., Ishikawa, Y., Kawata, M., Mitani, K., Miyazaki, M.
Format: Journal Article
Language:English
Published: New York, NY IEEE 01-01-1993
Institute of Electrical and Electronics Engineers
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Abstract A new basic ohmic contact technology for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is presented. The effect of the device parameters on the high-frequency performance of HBT ICs for 10-Gb/s systems is analyzed, and it is shown that, at a cutoff frequency (f/sub T/) of 40 GHz or more, reducing base resistance or collector capacitance is more effective than increasing f/sub T/ for obtaining high-frequency performance. A process is developed for fabricating base electrodes with a very low ohmic contact resistivity, approximately 10/sup -7/ Omega -cm/sup 2/, by using a AuZn/Mo/Au alloy, which provides the required high performance. Self-aligned AlGaAs/GaAs HBTs, with a 2.5- mu m*5- mu m emitter, using a AuZn/Mo/Au alloy base metal and an undoped GaAs collector, are shown to have an f/sub T/ and a maximum oscillation frequency of about 45 and 70 GHz, respectively, at 3.5 mA. An AGC amplifier with a 20-dB gain and a bandwidth of 13.7 GHz demonstrates stable performance.< >
AbstractList A new basic ohmic contact technology for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is presented. The effect of the device parameters on the high-frequency performance of HBT ICs for 10-Gb/s systems is analyzed, and it is shown that, at a cutoff frequency ( < e1 > f < /e1 > (T)) of 40 GHz or more, reducing base resistance or collector capacitance is more effective than increasing < e1 > f < /e1 > (T ) for obtaining high-frequency performance. A process is developed for fabricating base electrodes with a very low ohmic contact resistivity, ~10(-7) Omicron-cm(2), by using a AuZn/Mo/Au alloy, which provides the required high performance. Self-aligned AlGaAs/GaAs HBTs, with a 2.5-mumx5-mum emitter, using a AuZn/Mo/Au alloy base metal and an undoped GaAs collector, are shown to have an < e1 > f < /e1 > (T) and a maximum oscillation frequency of about 45 and 70 GHz, respectively, at 3.5 mA. An AGC amplifier with a 20-dB gain and a bandwidth of 13.7 GHz demonstrates stable performance
A new basic ohmic contact technology for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is presented. The effect of the device parameters on the high-frequency performance of HBT ICs for 10-Gb/s systems is analyzed, and it is shown that, at a cutoff frequency (f/sub T/) of 40 GHz or more, reducing base resistance or collector capacitance is more effective than increasing f/sub T/ for obtaining high-frequency performance. A process is developed for fabricating base electrodes with a very low ohmic contact resistivity, approximately 10/sup -7/ Omega -cm/sup 2/, by using a AuZn/Mo/Au alloy, which provides the required high performance. Self-aligned AlGaAs/GaAs HBTs, with a 2.5- mu m*5- mu m emitter, using a AuZn/Mo/Au alloy base metal and an undoped GaAs collector, are shown to have an f/sub T/ and a maximum oscillation frequency of about 45 and 70 GHz, respectively, at 3.5 mA. An AGC amplifier with a 20-dB gain and a bandwidth of 13.7 GHz demonstrates stable performance.< >
Author Mochizuki, K.
Miyazaki, M.
Mitani, K.
Ishikawa, Y.
Masuda, H.
Kawata, M.
Kusano, C.
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10.1109/16.40886
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Issue 1
Keywords Analog circuit
Ohmic contact
Circuit design
Computer simulation
Performance characteristic
Aluminium Gallium Arsenides Mixed
Theoretical study
Amplifier
Cut off frequency
Gallium Arsenides
Microelectronic fabrication
Integrated circuit
Heterojunction transistor
High frequency
Performance
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PublicationTitle IEEE transactions on electron devices
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Institute of Electrical and Electronics Engineers
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References ref8
maziar (ref4) 1986; 7
ref9
ref3
ref6
ref11
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ishibashi (ref7) 1990
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  doi: 10.1109/16.2471
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  doi: 10.1109/GAAS.1990.175444
– volume: 7
  start-page: 483
  year: 1986
  ident: ref4
  article-title: a proposed structure for collector transit-time reduction in algaas/gaas bipolar transistors
  publication-title: IEEE Electron Device Letters
  doi: 10.1109/EDL.1986.26447
  contributor:
    fullname: maziar
– start-page: 230
  year: 1990
  ident: ref7
  publication-title: High-Speed Digital IC Technologies
  contributor:
    fullname: ishibashi
– ident: ref3
  doi: 10.1109/16.40886
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  doi: 10.1109/ISSCC.1990.110189
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  doi: 10.1143/JJAP.29.1399
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  doi: 10.1109/IEDM.1990.237110
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  doi: 10.1143/JJAP.30.L266
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Snippet A new basic ohmic contact technology for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is presented. The effect of the device parameters on the...
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SubjectTerms Applied sciences
Capacitance
Conductivity
Cutoff frequency
Electrodes
Electronics
Exact sciences and technology
Gallium arsenide
Gold alloys
Heterojunction bipolar transistors
Ohmic contacts
Performance analysis
Performance gain
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Transistors
Title AlGaAs/GaAs HBTs for 10-Gb/s ICs using a new base ohmic contact fabrication process
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Volume 40
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