Consistent model for short-channel nMOSFET after hard gate oxide breakdown

Dissimilar post-hard-breakdown nMOSFET characteristics are consistently explained by the location of a constant-size breakdown path. Device simulations with the breakdown path modeled as a narrow inclusion of highly doped n-type silicon well reproduce all postbreakdown nFET characteristics, includin...

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Bibliographic Details
Published in:IEEE transactions on electron devices Vol. 49; no. 3; pp. 507 - 513
Main Authors: Kaczer, B., Degraeve, R., De Keersgieter, A., Van de Mieroop, K., Simons, V., Groeseneken, G.
Format: Journal Article
Language:English
Published: New York IEEE 01-03-2002
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Dissimilar post-hard-breakdown nMOSFET characteristics are consistently explained by the location of a constant-size breakdown path. Device simulations with the breakdown path modeled as a narrow inclusion of highly doped n-type silicon well reproduce all postbreakdown nFET characteristics, including the substrate current behavior, for both gate-to-substrate and gate-to-extension breakdowns. An equivalent circuit describing the gate current in an nFET after hard gate-oxide breakdown is proposed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9383
1557-9646
DOI:10.1109/16.987123