Effect of dislocations on VLWIR HgCdTe photodiodes

The effects of dislocations on very-long-wavelength infrared (VLWIR) HgCdTe photodiodes (cutoff wavelength > 14 mum at 40 K) have been determined experimentally and analyzed. The photodiodes are in the back-illuminated configuration, fabricated from HgCdTe p-on-n double-layer heterostructure (DLH...

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Published in:Journal of electronic materials Vol. 36; no. 8; pp. 1068 - 1076
Main Authors: PARODOS, T, FITZGERALD, E. A, HU, S, REINE, M, LOVECCHIO, P, CASTER, A, TOBIN, S, MARCINIEC, J, WELSCH, J, HAIRSTON, A, LAMARRE, P, RIENDEAU, J, WOODWARD, B
Format: Conference Proceeding Journal Article
Language:English
Published: New York, NY Institute of Electrical and Electronics Engineers 01-08-2007
Springer Nature B.V
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Summary:The effects of dislocations on very-long-wavelength infrared (VLWIR) HgCdTe photodiodes (cutoff wavelength > 14 mum at 40 K) have been determined experimentally and analyzed. The photodiodes are in the back-illuminated configuration, fabricated from HgCdTe p-on-n double-layer heterostructure (DLHJ) films grown at BAE Systems by liquid phase epitaxy (LPE) onto lattice-matched (111) CdZnTe substrates. Arrays were hybridized to silicon ROICs to form focal plane arrays (FPAs). After characterization for dark current and response, the arrays were dehybridized and stripped of their metals and passivation layers. Dislocations were revealed using a Hahnert and Schenk (H&S) etch. Pixel traceability was maintained throughout the analysis, permitting one-to-one correlation between photodiode performance and dislocation density measured within that photodiode. We found that response and dark current were correlated to etch pit density (EPD), which we assumed to be equal to dislocation density. Our results support earlier dislocation studies on larger-bandgap HgCdTe, which showed response was only weakly impacted by EPD, while dark current was strongly affected by EPD. Measured EPD values ranged from low 10 to low 10 cm. Potential causes for this range in EPD are discussed.
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ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-007-0173-x