The effect of annealing temperature on the electrical properties of metal-ferroelectric (PbZr 0.53Ti 0.47O 3)-insulator (ZrO 2)-semiconductor (MFIS) thin-film capacitors

Metal-ferroelectric-insulator-semiconductor (MFIS) thin-film structures using PbZr 0.53Ti 0.47O 3 (PZT) as the ferroelectric layer and zirconium oxide (ZrO 2) as the insulator layer were fabricated in this work. The leakage current and the C-V memory window were measured for MFIS capacitors with the...

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Bibliographic Details
Published in:Microelectronic engineering Vol. 84; no. 9; pp. 2014 - 2017
Main Authors: Juan, P.C., Jiang, J.D., Shih, W.C., Lee, J.Y.M.
Format: Journal Article Conference Proceeding
Language:English
Published: Amsterdam Elsevier B.V 01-09-2007
Elsevier Science
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Summary:Metal-ferroelectric-insulator-semiconductor (MFIS) thin-film structures using PbZr 0.53Ti 0.47O 3 (PZT) as the ferroelectric layer and zirconium oxide (ZrO 2) as the insulator layer were fabricated in this work. The leakage current and the C-V memory window were measured for MFIS capacitors with the PZT layer annealed at temperatures of 400 °C, 500 °C, 600 °C, 700 °C. The dominant conduction mechanism of Al/PZT(290 nm)/ZrO 2(15 nm)/Si structure is Poole-Frenkel emission in the temperature range of 300-425 K. Under a sweep voltage of 6 V, the largest memory window of 1.31 V was obtained for 500 °C-annealed samples. The memory window as a function of insulator thickness was also discussed. More serious charge injection is observed when the voltage was swept from negative to positive.
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content type line 23
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2007.04.004