25-nm Gate Length nMOSFET With Steep Channel Profiles Utilizing Carbon-Doped Silicon Layers (A P-Type Dopant Confinement Layer)

Steep channel profiles of scaled transistors are a promising approach for advancing transistor generation in bulk complementary metal-oxide-semiconductor (MOS). In this paper, a carbon-doped Si (Si:C) layer under an undoped Si layer is proposed to form steep p-type channel profiles in n-channel MOS...

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Bibliographic Details
Published in:IEEE transactions on electron devices Vol. 58; no. 5; pp. 1302 - 1310
Main Authors: Hokazono, A, Itokawa, H, Kusunoki, N, Mizushima, I, Inaba, S, Kawanaka, S, Toyoshima, Y
Format: Journal Article
Language:English
Published: New York, NY IEEE 01-05-2011
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Steep channel profiles of scaled transistors are a promising approach for advancing transistor generation in bulk complementary metal-oxide-semiconductor (MOS). In this paper, a carbon-doped Si (Si:C) layer under an undoped Si layer is proposed to form steep p-type channel profiles in n-channel MOS field-effect transistors (nMOSFETs) due to extremely low diffusivity of boron and indium in Si:C layers. This structure with low channel impurity improves mobility and suppresses threshold voltage ( V TH ) variation. Both items are essential for aggressively scaled MOSFETs with a gate length less than 25 nm. We demonstrated well-controlled, high-performance, and low V TH variability nMOSFETs with a Si:C-Si epitaxial channel structure.
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ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2011.2112770