Laser-induced selective copper deposition on polyimide

Laser irradiation of organometallic palladium compounds with an argon ion laser at 351 nm is used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution results in copper deposition. Since a few monolayers...

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Bibliographic Details
Published in:	Applied physics letters Vol. 53; no. 21; pp. 2111 - 2113
Main Authors:	COLE, H. S, LIU, Y. S, ROSE, J. W, GUIDA, R
Format:	Journal Article
Language:	English
Published:	Melville, NY American Institute of Physics 21-11-1988
Subjects:	Analysing. Testing. Standards Applied sciences Cross-disciplinary physics: materials science; rheology Exact sciences and technology Liquid phase epitaxy; deposition from liquid phases (melts, solutions, and surface layers on liquids) Materials science Measurement of properties and materials state Metals, semimetals and alloys Metals. Metallurgy Methods of deposition of films and coatings; film growth and epitaxy Nondestructive testing Physics Specific materials Polyimide Laser beam Chemical deposition Irradiation Transition metal Experimental study Electroless plating Thin film
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Summary:	Laser irradiation of organometallic palladium compounds with an argon ion laser at 351 nm is used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution results in copper deposition. Since a few monolayers of palladium are sufficient to catalyze the electroless copper process, fast writing speeds of several centimeters per second are obtained.
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23
ISSN:	0003-6951 1077-3118
DOI:	10.1063/1.100292