Development of buffer layers for high quality Tl-Pb-Sr-Ba-Ca-Cu-O thick films on flexible metal substrates

Previous work has demonstrated the ability to grow extremely high quality Tl/sub 0.5/Pb/sub 0.5/Sr/sub 1.6/Ba/sub 0.4/Ca/sub 2/Cu/sub 3/O/sub x/ epitaxial films up to 15 /spl mu/m thick using melt growth techniques on single crystal LaAlO/sub 3/ substrates. This melt growth process is an ideal candi...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity Vol. 7; no. 2; pp. 1969 - 1972
Main Authors: Parilla, P.A., McGraw, J.M., Schulz, D.L., Wendelin, J., Bhattacharya, R.N., Blaugher, R.D., Ginley, D.S., Voigt, J.A., Roth, E.P.
Format: Journal Article Conference Proceeding
Language:English
Published: New York, NY IEEE 01-06-1997
Institute of Electrical and Electronics Engineers
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Summary:Previous work has demonstrated the ability to grow extremely high quality Tl/sub 0.5/Pb/sub 0.5/Sr/sub 1.6/Ba/sub 0.4/Ca/sub 2/Cu/sub 3/O/sub x/ epitaxial films up to 15 /spl mu/m thick using melt growth techniques on single crystal LaAlO/sub 3/ substrates. This melt growth process is an ideal candidate for producing high quality superconducting films on flexible metal substrates with textured buffer layers; however, the textured buffer layer of choice, cubic yttria stabilized zirconia (YSZ), appears to be incompatible with the melt growth of TI-Pb-Sr-Ba-Ca-Cu-O films. In this work, we investigate textured buffer layers which are compatible with the epitaxial growth of Tl/sub 0.5/Pb/sub 0.5/Sr/sub 1.6/Ba/sub 0.4/Ca/sub 2/Cu/sub 3/O/sub x/ films. Crucial properties for the successful development of a suitable buffer layer are lattice matching, chemical stability and texture. Buffer layer materials investigated are CeO/sub 2/ and LaAlO/sub 3/ grown using a UV (248 nm) pulsed excimer laser deposition system equipped with multiple targets and a controlled ambient. Influence of substrate temperature and ambient gas pressure and flow on buffer growth are analyzed via XRD characterization. Highly textured buffer layers have been fabricated.
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ISSN:1051-8223
1558-2515
DOI:10.1109/77.620973