Author Correction: Addressing diffusion behavior and impact in an epoxy–amine cure system using molecular dynamics simulations

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Published in:Scientific reports Vol. 13; no. 1; p. 1408
Main Authors: Kwon, Sung Hyun, Kang, Haisu, Kim, Byeong‑Joo, Lee, Hyung Ik, Lee, Jung Min, Kim, Jungchul, Lee, Seung Geol
Format: Journal Article
Language:English
Published: London Nature Publishing Group UK 25-01-2023
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ArticleNumber 1408
Author Kwon, Sung Hyun
Lee, Jung Min
Kang, Haisu
Kim, Byeong‑Joo
Lee, Hyung Ik
Lee, Seung Geol
Kim, Jungchul
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  givenname: Sung Hyun
  surname: Kwon
  fullname: Kwon, Sung Hyun
  organization: School of Chemical Engineering, Pusan National University, Research Institute of Industrial Technology, Pusan National University
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  givenname: Haisu
  surname: Kang
  fullname: Kang, Haisu
  organization: School of Chemical Engineering, Pusan National University
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  givenname: Byeong‑Joo
  surname: Kim
  fullname: Kim, Byeong‑Joo
  organization: Agency for Defense Development
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  givenname: Hyung Ik
  surname: Lee
  fullname: Lee, Hyung Ik
  organization: Agency for Defense Development
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  givenname: Jung Min
  surname: Lee
  fullname: Lee, Jung Min
  organization: Agency for Defense Development
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  givenname: Jungchul
  surname: Kim
  fullname: Kim, Jungchul
  organization: Hankuk Carbon Co., Ltd
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  givenname: Seung Geol
  surname: Lee
  fullname: Lee, Seung Geol
  email: seunggeol.lee@pusan.ac.kr
  organization: School of Chemical Engineering, Pusan National University, Department of Organic Material Science and Engineering, Pusan National University
BackLink https://www.ncbi.nlm.nih.gov/pubmed/36697431$$D View this record in MEDLINE/PubMed
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Copyright The Author(s) 2023
The Author(s) 2023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.
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References 36599868 - Sci Rep. 2023 Jan 4;13(1):138
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Title Author Correction: Addressing diffusion behavior and impact in an epoxy–amine cure system using molecular dynamics simulations
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