FT IR spectroscopy of silicon oxide layers prepared with perchloric acid

► Formation of stoichiometric SiO2 layer with lowest density after chlorine oxidation ► KCN/HCN passivation contributes to formation of SiN, SiO and SiOH bonds at the expense of SiCl bonds. ► SiCN could not be identified due to overlapping of detected signal with absorption induced by CO2. Chlorine...

Full description

Saved in:
Bibliographic Details
Published in:Applied surface science Vol. 269; pp. 106 - 109
Main Authors: Kopani, M., Mikula, M., Takahashi, M., Rusnák, J., Pinčík, E.
Format: Journal Article
Language:English
Published: Amsterdam Elsevier B.V 15-03-2013
Elsevier
Subjects:
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:► Formation of stoichiometric SiO2 layer with lowest density after chlorine oxidation ► KCN/HCN passivation contributes to formation of SiN, SiO and SiOH bonds at the expense of SiCl bonds. ► SiCN could not be identified due to overlapping of detected signal with absorption induced by CO2. Chlorine oxidation is important methods for improvement of many properties such as passivation of mobile oxide charge, breakdown strength or enhancement of the minority-carrier lifetime in the underlying silicon. In this study we consider effects influencing the density of SiO2 layers formed by three different methods: thermal oxidation at 850°C, low temperature oxidation method by use of nitric acid – HNO3 (NAOS) and HClO4 afterward passivated with KCN/HCN solutions. Thicknesses of SiO2 layers determined by both capacitance–voltage (C–V) and XPS revealed fast oxidation rate compared with samples prepared by thermal oxidation. FT IR measurement showed that all absorption spectra are almost similar. Higher absorption of the sample prepared in HClO4 was observed. No SiCl bonds were visible. Calculated atomic density of the SiO2 layer obtained from IR measurements was lowest for sample formed in HClO4. Chlorine oxidation results in higher oxidation rate (higher thickness) and formation of stoichiometric SiO2 layer with lower density. Following KCN/HCN passivation causes formation of SiN, SiO and SiOH bonds at the expense of SiCl bonds.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2012.09.081