Evaluation of the cure kinetics of the wood/pMDI bondline

Micro-dielectric analysis (μDEA) and differential scanning calorimetry (DSC) were used to monitor cure of polymeric diphenylmethane diisocyanate (pMDI) resin with wood strands in a saturated steam environment. A first-order autocatalyzed kinetic model was employed to determine kinetic parameters. Th...

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Bibliographic Details
Published in:	International journal of adhesion and adhesives Vol. 21; no. 2; pp. 137 - 144
Main Authors:	Harper, David P., Wolcott, Michael P., Rials, Timothy G.
Format:	Journal Article
Language:	English
Published:	Oxford Elsevier Ltd 2001 Elsevier
Subjects:	Application fields Applied sciences B. Wood Cure kinetics Dielectric analysis Exact sciences and technology Miscellaneous Polymer industry, paints, wood Polymeric isocyanate Technology of polymers Wood Wood. Paper. Non wovens Dielectric analysis Cure kinetics B. Wood Polymeric isocyanate Wood Autocatalysis Experimental study Polyaddition Kinetic model Organic diisocyanate Polyurethane Adhesive joint Crosslinked polymer Particleboard Kinetics Measurement method Rate constant Adhesive Activation energy Comparative study Dielectric method
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