Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy
Shape memory alloy (SMA) discontinuous reinforcements in a solder matrix have the potential to reduce inelastic strains and improve thermo-mechanical fatigue (TMF) life of solder joints. In this work, concept viability was tested on a simpler configuration consisting of a single NiTi wire embedded i...
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| Published in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 421; no. 1; pp. 133 - 142 |
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| Language: | English |
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15-04-2006
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| Abstract | Shape memory alloy (SMA) discontinuous reinforcements in a solder matrix have the potential to reduce inelastic strains and improve thermo-mechanical fatigue (TMF) life of solder joints. In this work, concept viability was tested on a simpler configuration consisting of a single NiTi wire embedded in a cylindrical Sn–3.5Ag solder matrix. The composite samples were thermally cycled at a constant shear stress under double shear loading perpendicular to the fiber axis, and the local shear displacement was monitored. The local displacement plots indicate significant reduction in creep rate of the SMA reinforced composite versus a control Cu-wire reinforced composite, suggesting that SMA particulate reinforcements may be a feasible option. In order to understand and model the composite response, tests were also conducted on the bare NiTi wire. A preliminary model based on Eshelby's transformation strains provided reasonable agreement with the displacement response of the composites. |
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| AbstractList | Shape memory alloy (SMA) discontinuous reinforcements in a solder matrix have the potential to reduce inelastic strains and improve thermo-mechanical fatigue (TMF) life of solder joints. In this work, concept viability was tested on a simpler configuration consisting of a single NiTi wire embedded in a cylindrical Sn–3.5Ag solder matrix. The composite samples were thermally cycled at a constant shear stress under double shear loading perpendicular to the fiber axis, and the local shear displacement was monitored. The local displacement plots indicate significant reduction in creep rate of the SMA reinforced composite versus a control Cu-wire reinforced composite, suggesting that SMA particulate reinforcements may be a feasible option. In order to understand and model the composite response, tests were also conducted on the bare NiTi wire. A preliminary model based on Eshelby's transformation strains provided reasonable agreement with the displacement response of the composites. Shape memory alloy (SMA) discontinuous reinforcements in a solder matrix have the potential to reduce inelastic strains and improve thermo-mechanical fatigue (TMF) life of solder joints. In this work, concept viability was tested on a simpler configuration consisting of a single NiTi wire embedded in a cylindrical Sn-3.5Ag solder matrix. The composite samples were thermally cycled at a constant shear stress under double shear loading perpendicular to the fiber axis, and the local shear displacement was monitored. The local displacement plots indicate significant reduction in creep rate of the SMA reinforced composite versus a control Cu-wire reinforced composite, suggesting that SMA particulate reinforcements may be a feasible option. In order to understand and model the composite response, tests were also conducted on the bare NiTi wire. A prehminary model based on Eshelby's transformation strains provided reasonable agreement with the displacement response of the composites. |
| Author | Wang, Z.X. Majumdar, B.S. Dutta, I. |
| Author_xml | – sequence: 1 givenname: Z.X. surname: Wang fullname: Wang, Z.X. organization: Materials and Metallurgical Engineering Department, New Mexico Tech, Socorro, NM 87801, USA – sequence: 2 givenname: I. surname: Dutta fullname: Dutta, I. organization: Center for Materials Science and Engineering, Department of Mechanical Engineering Naval Postgraduate School, Monterey, CA 93943, USA – sequence: 3 givenname: B.S. surname: Majumdar fullname: Majumdar, B.S. email: majumdar@nmt.edu organization: Materials and Metallurgical Engineering Department, New Mexico Tech, Socorro, NM 87801, USA |
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| CitedBy_id | crossref_primary_10_1016_j_matdes_2012_02_041 crossref_primary_10_3139_146_110830 crossref_primary_10_1007_s11661_008_9676_1 crossref_primary_10_1007_s10854_008_9732_z crossref_primary_10_1007_s11665_012_0125_3 crossref_primary_10_1007_s10853_008_3188_7 crossref_primary_10_1016_j_msea_2013_05_061 crossref_primary_10_1007_s00707_015_1433_0 crossref_primary_10_1557_PROC_0968_V06_04 |
| Cites_doi | 10.1098/rspa.1957.0133 10.1016/S0020-7683(98)00332-1 10.1080/01418619808241907 10.1007/BF02652148 10.1016/S0749-6419(96)00030-7 10.1007/s11664-004-0131-9 10.1016/0001-6160(73)90064-3 10.1007/s11664-998-0125-0 10.1106/CFUG-YHNP-PP27-FCXD 10.1007/s11661-999-0136-3 10.1080/10759419608945861 10.1177/1045389X9000100205 10.1016/S1359-6454(01)00385-8 10.1557/PROC-360-497 10.1016/S0921-5093(99)00423-2 10.1007/s11664-002-0024-8 10.1016/S0169-4332(99)00280-9 10.1007/s11664-997-0251-0 10.1007/s11664-002-0008-8 10.1016/S0921-5093(00)00661-4 10.1016/0956-716X(91)90023-T 10.1007/s11664-999-0184-x 10.1016/S0921-4526(98)00378-0 10.1177/1045389X9400500306 10.1007/BF02669454 10.1016/S1359-6462(02)00032-5 10.1007/s11664-002-0141-4 10.1557/PROC-459-143 |
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| Keywords | Solders Shape memory alloy Creep Composite NiTi Electronic packaging Eshelby |
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| SubjectTerms | Composite Creep Electronic packaging Eshelby NiTi Shape memory alloy Solders |
| Title | Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy |
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