Free Space Dielectric Techniques for Diamond Composite Characterization

Compact millimeter-wave arrays demand novel packaging solutions that feature low-cost dielectric materials with significant thermal conductivity (<inline-formula><tex-math notation="LaTeX">\sim</tex-math></inline-formula>100 W/m ⋅ K). To characterize the permittivit...

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Bibliographic Details
Published in:IEEE journal of microwaves Vol. 4; no. 1; pp. 147 - 157
Main Authors: Chang, Shu-Ming, Swank, Chelsea, Kummel, Andrew, Buckwalter, James F.
Format: Journal Article
Language:English
Published: IEEE 01-01-2024
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Summary:Compact millimeter-wave arrays demand novel packaging solutions that feature low-cost dielectric materials with significant thermal conductivity (<inline-formula><tex-math notation="LaTeX">\sim</tex-math></inline-formula>100 W/m ⋅ K). To characterize the permittivity and loss tangent of the dielectric materials above 100 GHz, free-space characterization is proposed to avoid de-embedding conductor losses. We review current approaches for characterization to investigate the properties of ultradense diamond composite materials at D-band. We compare free-space calibration multiple methods to extract the permittivity and loss tangent. Time-domain gating is employed to reduce the uncertainty in the free space characterization. Material characterizations of the dielectric constant and loss tangent include pure polymer TMPTA, PDMS, TMPTA-based, PDMS-based diamond composites as well as quartz and sapphire wafers for calibration from 120-160 GHz. To the author's knowledge, this is the first characterization of diamond composites for thermally conductive dielectric packaging requirements at D-band.
ISSN:2692-8388
2692-8388
DOI:10.1109/JMW.2023.3339255