All-Digital Circuit-Level Dynamic Variation Monitor for Silicon Debug and Adaptive Clock Control

A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital conve...

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Published in:IEEE transactions on circuits and systems. I, Regular papers Vol. 58; no. 9; pp. 2017 - 2025
Main Authors: Bowman, K. A., Tokunaga, C., Tschanz, J. W., Raychowdhury, A., Khellah, M. M., Geuskens, B. M., Lu, Shih-Lien L., Aseron, P. A., Karnik, T., De, V. K.
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Published: New York IEEE 01-09-2011
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital converter, and multiplexers to measure circuit delay or frequency changes with less than a 1% measured resolution error while capturing clock-to-data correlations. In validating the DVM with microprocessor maximum clock frequency (F MAX ) measurements, an on-die noise injector circuit induces a supply voltage (V CC ) droop at a particular cycle in the test program. The F MAX measurement is then repeated for over a thousand iterations while shifting the droop placement to a different cycle per iteration. Silicon measurements demonstrate the DVM capability of tracking the worst case F MAX reduction to within 1% for a wide range of V CC droop profiles. Furthermore, silicon measurements reveal that F MAX is highly sensitive to the placement and magnitude of a high-frequency V CC droop during program execution, thus highlighting the value of the DVM for silicon debug. In addition, the DVM interfaces with an adaptive clock control circuit to dynamically adjust the clock frequency by changing the divide ratio in the phase-locked loop in response to persistent variations, enabling the microprocessor to adapt to the operating environment for maximum efficiency.
AbstractList A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital converter, and multiplexers to measure circuit delay or frequency changes with less than a 1% measured resolution error while capturing clock-to-data correlations. In validating the DVM with microprocessor maximum clock frequency [Formula Omitted] measurements, an on-die noise injector circuit induces a supply voltage [Formula Omitted] droop at a particular cycle in the test program. The [Formula Omitted] measurement is then repeated for over a thousand iterations while shifting the droop placement to a different cycle per iteration. Silicon measurements demonstrate the DVM capability of tracking the worst case [Formula Omitted] reduction to within 1% for a wide range of [Formula Omitted] droop profiles. Furthermore, silicon measurements reveal that [Formula Omitted] is highly sensitive to the placement and magnitude of a high-frequency [Formula Omitted] droop during program execution, thus highlighting the value of the DVM for silicon debug. In addition, the DVM interfaces with an adaptive clock control circuit to dynamically adjust the clock frequency by changing the divide ratio in the phase-locked loop in response to persistent variations, enabling the microprocessor to adapt to the operating environment for maximum efficiency.
A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital converter, and multiplexers to measure circuit delay or frequency changes with less than a 1% measured resolution error while capturing clock-to-data correlations. In validating the DVM with microprocessor maximum clock frequency ( rm F rm MAX ) measurements, an on-die noise injector circuit induces a supply voltage ( rm V rm CC ) droop at a particular cycle in the test program. The rm F rm MAX measurement is then repeated for over a thousand iterations while shifting the droop placement to a different cycle per iteration. Silicon measurements demonstrate the DVM capability of tracking the worst case rm F rm MAX reduction to within 1% for a wide range of rm V rm CC droop profiles. Furthermore, silicon measurements reveal that rm F rm MAX is highly sensitive to the placement and magnitude of a high-frequency rm V rm CC droop during program execution, thus highlighting the value of the DVM for silicon debug. In addition, the DVM interfaces with an adaptive clock control circuit to dynamically adjust the clock frequency by changing the divide ratio in the phase-locked loop in response to persistent variations, enabling the microprocessor to adapt to the operating environment for maximum efficiency.
A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on circuit-level performance to enhance silicon debug and adaptive clock control. The DVM consists of a tunable replica circuit, a time-to-digital converter, and multiplexers to measure circuit delay or frequency changes with less than a 1% measured resolution error while capturing clock-to-data correlations. In validating the DVM with microprocessor maximum clock frequency (F MAX ) measurements, an on-die noise injector circuit induces a supply voltage (V CC ) droop at a particular cycle in the test program. The F MAX measurement is then repeated for over a thousand iterations while shifting the droop placement to a different cycle per iteration. Silicon measurements demonstrate the DVM capability of tracking the worst case F MAX reduction to within 1% for a wide range of V CC droop profiles. Furthermore, silicon measurements reveal that F MAX is highly sensitive to the placement and magnitude of a high-frequency V CC droop during program execution, thus highlighting the value of the DVM for silicon debug. In addition, the DVM interfaces with an adaptive clock control circuit to dynamically adjust the clock frequency by changing the divide ratio in the phase-locked loop in response to persistent variations, enabling the microprocessor to adapt to the operating environment for maximum efficiency.
Author Bowman, K. A.
De, V. K.
Aseron, P. A.
Khellah, M. M.
Tokunaga, C.
Tschanz, J. W.
Geuskens, B. M.
Karnik, T.
Raychowdhury, A.
Lu, Shih-Lien L.
Author_xml – sequence: 1
  givenname: K. A.
  surname: Bowman
  fullname: Bowman, K. A.
  email: keith.a.bowman@intel.com
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 2
  givenname: C.
  surname: Tokunaga
  fullname: Tokunaga, C.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 3
  givenname: J. W.
  surname: Tschanz
  fullname: Tschanz, J. W.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 4
  givenname: A.
  surname: Raychowdhury
  fullname: Raychowdhury, A.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 5
  givenname: M. M.
  surname: Khellah
  fullname: Khellah, M. M.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 6
  givenname: B. M.
  surname: Geuskens
  fullname: Geuskens, B. M.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 7
  givenname: Shih-Lien L.
  surname: Lu
  fullname: Lu, Shih-Lien L.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 8
  givenname: P. A.
  surname: Aseron
  fullname: Aseron, P. A.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 9
  givenname: T.
  surname: Karnik
  fullname: Karnik, T.
  organization: Intel Corp., Hillsboro, OR, USA
– sequence: 10
  givenname: V. K.
  surname: De
  fullname: De, V. K.
  organization: Intel Corp., Hillsboro, OR, USA
BookMark eNpdkMFO3DAQhq2KSgXaB6h6sbj0lGXGTrzOcZWFgrRVD9BeXa8zQQavvXUSJN6-Xi3iwMEaa_T9o5nvjJ3EFImxrwgLRGgv77u724UAxIVAJXUrP7BTbBpdgQZ1cvjXbaWl0J_Y2Tg-AogWJJ6yv6sQqrV_8JMNvPPZzX6qNvRMga9fot15x__Y7O3kU-Q_U_RTynwo784H70pvTdv5gdvY81Vv95N_Jt6F5J54l-KUU_jMPg42jPTltZ6z39dX991Ntfn147ZbbSonRT1VPfXorINaDASAJHrbaK203aIGjYNayoYaWTtVbrBt3xJshRWwxC1aUr08Z9-Pc_c5_ZtpnMzOj45CsJHSPJpWlCTUoAp58Y58THOOZTmjizi1BCELhEfI5TSOmQazz35n84tBMAfj5mDcHIybV-Ml8-2Y8UT0xiuAVqCQ_wGbv32g
CODEN ITCSCH
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ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Sep 2011
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Sep 2011
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
F28
FR3
DOI 10.1109/TCSI.2011.2163893
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library Online
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
ANTE: Abstracts in New Technology & Engineering
Engineering Research Database
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
Engineering Research Database
ANTE: Abstracts in New Technology & Engineering
DatabaseTitleList Technology Research Database
Engineering Research Database

Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: http://ieeexplore.ieee.org/Xplore/DynWel.jsp
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1558-0806
EndPage 2025
ExternalDocumentID 2453060911
10_1109_TCSI_2011_2163893
6009212
Genre orig-research
GroupedDBID 0R~
29I
4.4
5VS
6IK
97E
AAJGR
AASAJ
ABQJQ
ABVLG
ACIWK
AETIX
AIBXA
AKJIK
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
EJD
HZ~
H~9
IFIPE
IPLJI
JAVBF
M43
O9-
OCL
PZZ
RIA
RIE
RIG
RNS
VJK
XFK
AAYXX
CITATION
7SP
8FD
L7M
F28
FR3
ID FETCH-LOGICAL-c324t-ded1cac042fe001e2da58868ab18081f6735e534c6328a9d9e0b2a2071b1ae6d3
IEDL.DBID RIE
ISSN 1549-8328
IngestDate Sat Aug 17 01:35:57 EDT 2024
Thu Oct 10 20:07:49 EDT 2024
Fri Aug 23 01:04:28 EDT 2024
Wed Jun 26 19:20:18 EDT 2024
IsPeerReviewed true
IsScholarly true
Issue 9
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c324t-ded1cac042fe001e2da58868ab18081f6735e534c6328a9d9e0b2a2071b1ae6d3
Notes ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
PQID 889367023
PQPubID 85411
PageCount 9
ParticipantIDs proquest_journals_889367023
crossref_primary_10_1109_TCSI_2011_2163893
ieee_primary_6009212
proquest_miscellaneous_926320406
PublicationCentury 2000
PublicationDate 2011-09-01
PublicationDateYYYYMMDD 2011-09-01
PublicationDate_xml – month: 09
  year: 2011
  text: 2011-09-01
  day: 01
PublicationDecade 2010
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE transactions on circuits and systems. I, Regular papers
PublicationTitleAbbrev TCSI
PublicationYear 2011
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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SSID ssj0029031
Score 2.1831126
Snippet A 45 nm microprocessor integrates an all-digital dynamic variation monitor (DVM) to continuously measure the impact of dynamic parameter variations on...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Publisher
StartPage 2017
SubjectTerms Adaptive circuit
adaptive clocking
Adaptive control systems
Circuits
Clocks
Delay
dynamic variation
Dynamics
Frequency measurement
Microprocessors
Monitoring
Monitors
Placement
Silicon
supply voltage droop
Temperature measurement
variation detector
variation monitor
variation sensor
variation tolerance
Title All-Digital Circuit-Level Dynamic Variation Monitor for Silicon Debug and Adaptive Clock Control
URI https://ieeexplore.ieee.org/document/6009212
https://www.proquest.com/docview/889367023
https://search.proquest.com/docview/926320406
Volume 58
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwELaACQbeiFJAHpgQhrxjj1VaBBJiKSC2cLEvVUWVVm3z_znHaQWChS1SrCi6z_fynb9j7MrHsPDAoCiNCkWkQYpCRlqgCUqKjtFAbO8OPwzT53fZH1ianJv1XRhEbJrP8NY-NrV8M9W1PSq7SyxDkB0pvJkq6e5qrZMr5YWOGzVSgnapbCuYvqfuXrLhoyPrDPzGQf_wQc1QlV-WuHEv93v_-7F9ttuGkbzncD9gG1gdsp1v5IJH7KM3mYj-eGSngvBsPNf1eCmebI8Q77sx9PyNEuUGGe5Ue84phOXD8YS2R8XJFNUjDpXhPQMzaxZ5Rq7vk2euvf2Yvd4PXrIH0c5TEJrCpqUwaHwNmtS0RPJOGBAQUiYSCt_O3yiTNIwxDiOdkPxAGYVeEUBAQUjhAyYmPGFb1bTCU8ajGDUURaligChSIMsUIEiCFDBVoE2HXa8knM8cbUbepBueyi0cuYUjb-HosCMr0vXCVpod1l1hkreKtcglrU9SCjQ6jK_fkkbYMgdUOK0XubIU9GSbkrO_v9tl2-5g2DaKnbOt5bzGC7a5MPVls6W-ANayytk
link.rule.ids 315,782,786,798,27933,27934,54767
linkProvider IEEE
linkToHtml http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LTxsxELZaOLQ9FFqoGqCtDz2huuzTax-jDSioKZcExM2dtWdR1GiDkuz_Z7xeolZw4bbSWqvVfJ6XZ_wNY99jTKsIHIra6VRkFpSoVGYFuqSm6Bgd5P7u8HhaXN2q0bmnyfmxvQuDiF3zGf70j10t3y1t64_KzqRnCPIjhXfzrJBFuK21Ta90lAZ21EwL2qeqr2HGkT6bldPLQNeZxJ2L_s8LdWNVntjizsFc7L3s1_bZ-z6Q5MOA_Af2CpuP7N0_9IIH7M9wsRCj-Z2fC8LL-cq2842Y-C4hPgqD6PkNpcodNjwo94pTEMun8wVtkIaTMWrvODSODx3ce8PIS3J-f3kZGtwP2fXF-awci36igrAUOG2EQxdbsKSoNZJ_woSgUEoqqGI_gaOWRZpjnmZWkvxAO41RlUBCYUgVA0qXfmI7zbLBz4xnOVqoqlrnAFmmQdUFQCKTArDQYN2AnT5K2NwH4gzTJRyRNh4O4-EwPRwDduBFul3YS3PAjh8xMb1qrY2i9bKgUGPA-PYt6YQvdECDy3ZttCehJ-skj57_7jf2Zjz7PTGTy6tfx-xtOCb2bWMnbGezavELe7127dduez0ArLLOKg
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=All-Digital+Circuit-Level+Dynamic+Variation+Monitor+for+Silicon+Debug+and+Adaptive+Clock+Control&rft.jtitle=IEEE+transactions+on+circuits+and+systems.+I%2C+Regular+papers&rft.au=Bowman%2C+K.+A.&rft.au=Tokunaga%2C+C.&rft.au=Tschanz%2C+J.+W.&rft.au=Raychowdhury%2C+A.&rft.date=2011-09-01&rft.pub=IEEE&rft.issn=1549-8328&rft.eissn=1558-0806&rft.volume=58&rft.issue=9&rft.spage=2017&rft.epage=2025&rft_id=info:doi/10.1109%2FTCSI.2011.2163893&rft.externalDocID=6009212
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1549-8328&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1549-8328&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1549-8328&client=summon