Optomechanical Monte Carlo Tolerancing Study of a Packaged Free-Space Intra-MCM Optical Interconnect System

We report on the performance of an intra-multichip-module free-space optical interconnect that integrates microlenses and a deflection prism above a dense optoelectronic chip, under various fabrication and assembly errors. This paper describes the results of a combination of mechanical Monte Carlo a...

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Bibliographic Details
Published in:	IEEE journal of selected topics in quantum electronics Vol. 12; no. 5; pp. 988 - 996
Main Authors:	Vervaeke, M., Debaes, C., Volckaerts, B., Thienpont, H.
Format:	Journal Article
Language:	English
Published:	New York IEEE 01-09-2006 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:	Accuracy Algorithms Analytical models Assembly Computer simulation Deep lithography with protons (DLP) Laboratories Lenses Microoptics Monte Carlo methods Monte Carlo simulation Noise levels Optical device fabrication Optical interconnections Optical interconnects Optical sensors Optical wireless Optoelectronic devices Packaging Sensitivity analysis Studies
Online Access:	Get full text
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