Embedded Fiber Bragg Grating (FBG) Sensors Fabricated by Ultrasonic Additive Manufacturing for High-Frequency Dynamic Strain Measurements
This paper demonstrates high-frequency dynamic strain measurements using Fiber Bragg Grating (FBG) sensors embedded in metal parts. Using an ultrasonic additive manufacturing (UAM) process, FBGs inscribed in polyimide coated optical fibers were embedded in aluminum parts. An electromagnetic shaker w...
Saved in:
Published in: | IEEE sensors journal Vol. 24; no. 3; p. 1 |
---|---|
Main Authors: | , , , , , , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
New York
IEEE
01-02-2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Abstract | This paper demonstrates high-frequency dynamic strain measurements using Fiber Bragg Grating (FBG) sensors embedded in metal parts. Using an ultrasonic additive manufacturing (UAM) process, FBGs inscribed in polyimide coated optical fibers were embedded in aluminum parts. An electromagnetic shaker was used to exert dynamic events on the embedded FBG sensors with frequencies from 1-10 kHz. The high-speed interrogation of FBG sensors was accomplished using a tunable vertical-cavity surface-emitting laser (VCSEL) and a high-speed interrogation system sampling at 120 kHz. The strain response measured by the FBG sensors was compared with real-time measurements using a laser velocimeter. Finite Element Analysis was performed to simulate responses to both static strain and high-frequency dynamic strain. Results show that strains as small as 2.5 μ can be resolved at frequencies up to 10 kHz. |
---|---|
AbstractList | This article demonstrates high-frequency dynamic strain measurements using fiber Bragg grating (FBG) sensors embedded in metal parts. Using an ultrasonic additive manufacturing (UAM) process, FBGs inscribed in polyimide coated optical fibers were embedded in aluminum parts. An electromagnetic shaker was used to exert dynamic events on the embedded FBG sensors with frequencies from 1 to 10 kHz. The high-speed interrogation of FBG sensors was accomplished using a tunable vertical-cavity surface-emitting laser (VCSEL) and a high-speed interrogation system sampling at 120 kHz. The strain response measured by the FBG sensors was compared with real-time measurements using a laser velocimeter. A finite-element analysis (FEA) was performed to simulate responses to both static strain and high-frequency dynamic strain. In conclusion, results show that strains as small as 2.5$με$ can be resolved at frequencies up to 10 kHz. This article demonstrates high-frequency dynamic strain measurements using fiber Bragg grating (FBG) sensors embedded in metal parts. Using an ultrasonic additive manufacturing (UAM) process, FBGs inscribed in polyimide coated optical fibers were embedded in aluminum parts. An electromagnetic shaker was used to exert dynamic events on the embedded FBG sensors with frequencies from 1 to 10 kHz. The high-speed interrogation of FBG sensors was accomplished using a tunable vertical-cavity surface-emitting laser (VCSEL) and a high-speed interrogation system sampling at 120 kHz. The strain response measured by the FBG sensors was compared with real-time measurements using a laser velocimeter. A finite-element analysis (FEA) was performed to simulate responses to both static strain and high-frequency dynamic strain. Results show that strains as small as [Formula Omitted] can be resolved at frequencies up to 10 kHz. This paper demonstrates high-frequency dynamic strain measurements using Fiber Bragg Grating (FBG) sensors embedded in metal parts. Using an ultrasonic additive manufacturing (UAM) process, FBGs inscribed in polyimide coated optical fibers were embedded in aluminum parts. An electromagnetic shaker was used to exert dynamic events on the embedded FBG sensors with frequencies from 1-10 kHz. The high-speed interrogation of FBG sensors was accomplished using a tunable vertical-cavity surface-emitting laser (VCSEL) and a high-speed interrogation system sampling at 120 kHz. The strain response measured by the FBG sensors was compared with real-time measurements using a laser velocimeter. Finite Element Analysis was performed to simulate responses to both static strain and high-frequency dynamic strain. Results show that strains as small as 2.5 μ can be resolved at frequencies up to 10 kHz. |
Author | Bajaj, Nikhil Ahmed, Moinuddin Dong, Wen To, Albert Wang, Qirui Zhao, Jieru Petrie, Christian M. Zhong, Shuda Splain, Zach Hinds, Thomas Chen, Kevin P. Li, Yuqi |
Author_xml | – sequence: 1 givenname: Jieru orcidid: 0000-0003-3816-9146 surname: Zhao fullname: Zhao, Jieru organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 2 givenname: Wen surname: Dong fullname: Dong, Wen organization: Department of Mechanical Engineering & Materials Science, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 3 givenname: Thomas surname: Hinds fullname: Hinds, Thomas organization: Department of Mechanical Engineering & Materials Science, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 4 givenname: Yuqi orcidid: 0000-0002-9164-3663 surname: Li fullname: Li, Yuqi organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 5 givenname: Zach surname: Splain fullname: Splain, Zach organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 6 givenname: Shuda surname: Zhong fullname: Zhong, Shuda organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 7 givenname: Qirui orcidid: 0000-0001-9530-6907 surname: Wang fullname: Wang, Qirui organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 8 givenname: Nikhil orcidid: 0000-0003-3588-5702 surname: Bajaj fullname: Bajaj, Nikhil organization: Department of Mechanical Engineering & Materials Science, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 9 givenname: Albert surname: To fullname: To, Albert organization: Department of Mechanical Engineering & Materials Science, University of Pittsburgh, Pittsburgh, PA, USA – sequence: 10 givenname: Moinuddin surname: Ahmed fullname: Ahmed, Moinuddin organization: Argonne National Laboratory, Lemont, IL, USA – sequence: 11 givenname: Christian M. orcidid: 0000-0003-1167-3545 surname: Petrie fullname: Petrie, Christian M. organization: Oak Ridge National Laboratory, Oak Ridge, TN, USA – sequence: 12 givenname: Kevin P. orcidid: 0000-0003-1595-4475 surname: Chen fullname: Chen, Kevin P. organization: Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA |
BackLink | https://www.osti.gov/biblio/2283850$$D View this record in Osti.gov |
BookMark | eNpNkctuFDEQRS0UJPLgA5BYWLCBRQ922-7uWeYxPQlKYDFEYmf5UZ44ytjBdkeaT-CvcWuyYFW1OKd0VfcEHYUYAKEPlCwoJctv3zerH4uWtGzBGGcd4W_QMRViaGjPh6N5Z6ThrP_9Dp3k_EgIXfaiP0Z_VzsN1oLFo9eQ8EVS2y1eJ1V82OIv48X6K95AyDFlPCqdvFGlwnqP759KUjkGb_C5tb74F8B3KkxOmTKl2XYx4Wu_fWjGBH8mCGaPr_ZB7aqxqa4P-A5UnhLsIJR8ht469ZTh_es8Rffj6tfldXP7c31zeX7bGNbS0mjdE0dE17XUGmeY5bYDbSnh1Aqtly2z1LkB6CActKLjwilKLR_A9INiip2iT4e7MRcvs_EFzIOJIYApsm0HNghSoc8H6DnFGj0X-RinFGou2S7rm4f64a5S9ECZFHNO4ORz8juV9pISOdci51rkXIt8raU6Hw-OB4D_eNaTngv2D7yPi-w |
CODEN | ISJEAZ |
CitedBy_id | crossref_primary_10_1364_OL_519450 crossref_primary_10_3390_s24123919 |
Cites_doi | 10.1088/0957-0233/24/9/094017 10.1155/2016/5204581 10.3390/s19224917 10.1088/1361-665x/ab2a27 10.1177/1475921703002002004 10.1016/j.jnucmat.2021.153012 10.1109/JSEN.2005.844539 10.1016/j.matdes.2013.02.067 10.1109/icsens.2014.6985019 10.1364/OFS.2022.Th4.55 10.1088/0964-1726/16/3/025 10.1111/j.1365-246X.1975.tb05890.x 10.1109/tim.2021.3089231 10.1016/j.conbuildmat.2016.09.086 10.1016/j.sna.2009.10.020 10.1109/JLT.2014.2366835 10.1109/JLT.2006.886064 10.1016/j.compstruct.2010.01.007 10.1016/j.jmatprotec.2011.05.003 10.1109/access.2019.2905349 10.1557/jmr.2014.139 10.1109/LPT.2010.2052797 10.1007/s11837-017-2709-8 10.1016/j.compstruct.2014.02.014 10.1155/2020/1064870 10.1109/2944.902146 10.1007/s11661-020-06131-2 10.1016/j.yofte.2019.102015 10.1016/j.addma.2022.102681 10.1117/12.2228753 10.1016/j.msea.2019.138457 10.1109/tim.2023.3268466 10.1016/j.mfglet.2021.08.001 10.1016/j.ymssp.2016.07.006 10.1109/TIM.2017.2676218 10.1016/j.mfglet.2020.07.006 10.1016/S0266-3538(01)00037-9 10.1088/0964-1726/18/9/095043 10.18494/sam.2016.1189 10.1016/j.sna.2018.11.024 10.1117/12.2041821 10.1088/1361-665x/ab0b4e 10.1108/rpj-03-2019-0056 10.1117/12.424806 10.1016/j.engstruct.2005.04.023 10.1007/1-4020-3661-2_20 10.1016/j.matdes.2016.02.099 10.1088/1361-665x/abc23a 10.1088/0964-1726/23/10/105011 10.1016/j.sna.2020.112075 10.1007/s00170-020-06439-8 10.1117/12.2219690 10.1109/jlt.2020.3010722 10.1109/cecit58139.2022.00049 10.1109/jsen.2019.2927901 10.1016/j.jmapro.2018.03.027 |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024 |
CorporateAuthor | Univ. of Pittsburgh, PA (United States) Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States) |
CorporateAuthor_xml | – name: Univ. of Pittsburgh, PA (United States) – name: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States) |
DBID | 97E RIA RIE AAYXX CITATION 7SP 7U5 8FD L7M OTOTI |
DOI | 10.1109/JSEN.2023.3343604 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library Online CrossRef Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace OSTI.GOV |
DatabaseTitle | CrossRef Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
DatabaseTitleList | Solid State and Superconductivity Abstracts |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: http://ieeexplore.ieee.org/Xplore/DynWel.jsp sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Geography Engineering |
EISSN | 1558-1748 |
EndPage | 1 |
ExternalDocumentID | 2283850 10_1109_JSEN_2023_3343604 10370745 |
Genre | orig-research |
GrantInformation_xml | – fundername: U.S. Department of Energy grantid: DE-NE0008686; DE-NE0008994 funderid: 10.13039/100000015 |
GroupedDBID | -~X 0R~ 29I 4.4 5GY 6IK 97E AAJGR AASAJ ABQJQ ABVLG ACGFO ACGFS ACIWK AENEX AJQPL AKJIK ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 EBS F5P HZ~ IFIPE IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RIG RNS TWZ AAYXX CITATION 7SP 7U5 8FD L7M OTOTI |
ID | FETCH-LOGICAL-c321t-bb70f056621dcfc3d4d6ebd1041d5bb923d1ff8e185fe25645fa11d48ec78a3a3 |
IEDL.DBID | RIE |
ISSN | 1530-437X |
IngestDate | Mon Feb 19 05:01:09 EST 2024 Fri Nov 15 22:45:01 EST 2024 Fri Aug 23 00:24:28 EDT 2024 Wed Jun 26 19:24:17 EDT 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 3 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c321t-bb70f056621dcfc3d4d6ebd1041d5bb923d1ff8e185fe25645fa11d48ec78a3a3 |
Notes | USDOE AC05-00OR22725; NE0008994; NE0008686 |
ORCID | 0000-0002-9164-3663 0000-0001-9530-6907 0000-0003-1167-3545 0000-0003-1595-4475 0000-0003-3816-9146 0000-0003-3588-5702 0000-0002-7214-5335 0000-0003-1136-2544 0000-0003-3653-2984 0000000311673545 0000000315954475 0000000291643663 0000000338169146 0000000272145335 0000000335885702 0000000311362544 0000000336532984 |
PQID | 2920286046 |
PQPubID | 75733 |
PageCount | 1 |
ParticipantIDs | ieee_primary_10370745 proquest_journals_2920286046 crossref_primary_10_1109_JSEN_2023_3343604 osti_scitechconnect_2283850 |
PublicationCentury | 2000 |
PublicationDate | 2024-02-01 |
PublicationDateYYYYMMDD | 2024-02-01 |
PublicationDate_xml | – month: 02 year: 2024 text: 2024-02-01 day: 01 |
PublicationDecade | 2020 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York – name: United States |
PublicationTitle | IEEE sensors journal |
PublicationTitleAbbrev | JSEN |
PublicationYear | 2024 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref13 ref57 ref12 ref15 ref59 ref14 ref58 ref53 ref52 ref11 ref55 ref10 ref54 ref17 ref16 ref19 ref18 Garcia-Souto (ref56); 9157 ref51 ref50 ref45 ref48 ref47 ref42 ref41 ref44 ref43 ref49 ref8 ref9 ref4 Beukema (ref1); 3 ref3 ref6 ref5 ref40 Black (ref36) 2008; 8 ref35 ref34 ref37 ref31 ref30 ref32 ref2 ref39 ref38 ref24 ref23 ref26 ref25 ref20 Zhou (ref7) 2003; 5 ref22 ref21 ref28 ref27 ref29 (ref46) 2022 Brandt (ref33) ref60 ref62 ref61 |
References_xml | – ident: ref54 doi: 10.1088/0957-0233/24/9/094017 – ident: ref55 doi: 10.1155/2016/5204581 – ident: ref62 doi: 10.3390/s19224917 – ident: ref40 doi: 10.1088/1361-665x/ab2a27 – ident: ref11 doi: 10.1177/1475921703002002004 – ident: ref12 doi: 10.1016/j.jnucmat.2021.153012 – ident: ref5 doi: 10.1109/JSEN.2005.844539 – ident: ref16 doi: 10.1016/j.matdes.2013.02.067 – ident: ref47 doi: 10.1109/icsens.2014.6985019 – ident: ref49 doi: 10.1364/OFS.2022.Th4.55 – ident: ref3 doi: 10.1088/0964-1726/16/3/025 – ident: ref61 doi: 10.1111/j.1365-246X.1975.tb05890.x – ident: ref28 doi: 10.1109/tim.2021.3089231 – ident: ref6 doi: 10.1016/j.conbuildmat.2016.09.086 – ident: ref9 doi: 10.1016/j.sna.2009.10.020 – ident: ref24 doi: 10.1109/JLT.2014.2366835 – ident: ref52 doi: 10.1109/JLT.2006.886064 – ident: ref4 doi: 10.1016/j.compstruct.2010.01.007 – ident: ref27 doi: 10.1016/j.jmatprotec.2011.05.003 – ident: ref21 doi: 10.1109/access.2019.2905349 – ident: ref41 doi: 10.1557/jmr.2014.139 – ident: ref53 doi: 10.1109/LPT.2010.2052797 – ident: ref59 doi: 10.1007/s11837-017-2709-8 – ident: ref15 doi: 10.1016/j.compstruct.2014.02.014 – ident: ref35 doi: 10.1155/2020/1064870 – ident: ref50 doi: 10.1109/2944.902146 – ident: ref32 doi: 10.1007/s11661-020-06131-2 – start-page: 26 volume-title: Proc. 11th Int. Conf. Mech. Eng. Design Synchrotron Radiat. Equip. Instrum. ident: ref33 article-title: A review of ultrasonic additive manufacturing for particle accelerator applications contributor: fullname: Brandt – ident: ref2 doi: 10.1016/j.yofte.2019.102015 – ident: ref30 doi: 10.1016/j.addma.2022.102681 – ident: ref18 doi: 10.1117/12.2228753 – ident: ref42 doi: 10.1016/j.msea.2019.138457 – volume: 9157 volume-title: Proc. SPIE ident: ref56 article-title: Evaluation of a 1540 nm VCSEL for fibre Bragg gratings interrogation in dynamic measurement applications contributor: fullname: Garcia-Souto – ident: ref25 doi: 10.1109/tim.2023.3268466 – volume: 5 start-page: 116 issue: 1 year: 2003 ident: ref7 article-title: Techniques of advanced FBG sensors: Fabrication, demodulation, encapsulation and their application in the structural health monitoring of bridges publication-title: Pacific Sci. Rev. contributor: fullname: Zhou – ident: ref29 doi: 10.1016/j.mfglet.2021.08.001 – ident: ref13 doi: 10.1016/j.ymssp.2016.07.006 – ident: ref37 doi: 10.1109/TIM.2017.2676218 – ident: ref43 doi: 10.1016/j.mfglet.2020.07.006 – ident: ref23 doi: 10.1016/S0266-3538(01)00037-9 – ident: ref10 doi: 10.1088/0964-1726/18/9/095043 – volume: 3 start-page: 1 volume-title: Proc. 6th Eur. Workshop Struct. Health Monit. ident: ref1 article-title: Embedding technologies of FBG sensors in composites: Technologies, applications and practical use contributor: fullname: Beukema – ident: ref19 doi: 10.18494/sam.2016.1189 – ident: ref20 doi: 10.1016/j.sna.2018.11.024 – ident: ref60 doi: 10.1117/12.2041821 – ident: ref39 doi: 10.1088/1361-665x/ab0b4e – ident: ref26 doi: 10.1108/rpj-03-2019-0056 – ident: ref51 doi: 10.1117/12.424806 – ident: ref38 doi: 10.1016/j.engstruct.2005.04.023 – ident: ref8 doi: 10.1007/1-4020-3661-2_20 – ident: ref17 doi: 10.1016/j.matdes.2016.02.099 – ident: ref48 doi: 10.1088/1361-665x/abc23a – ident: ref14 doi: 10.1088/0964-1726/23/10/105011 – volume-title: Optical Sensing Interrogator, si90 year: 2022 ident: ref46 – ident: ref45 doi: 10.1016/j.sna.2020.112075 – ident: ref31 doi: 10.1007/s00170-020-06439-8 – ident: ref44 doi: 10.1117/12.2219690 – ident: ref22 doi: 10.1109/jlt.2020.3010722 – ident: ref58 doi: 10.1109/cecit58139.2022.00049 – volume: 8 start-page: 18 year: 2008 ident: ref36 article-title: On the gage factor for optical fiber grating strain gages publication-title: Sampe contributor: fullname: Black – ident: ref57 doi: 10.1109/jsen.2019.2927901 – ident: ref34 doi: 10.1016/j.jmapro.2018.03.027 |
SSID | ssj0019757 |
Score | 2.4547026 |
Snippet | This paper demonstrates high-frequency dynamic strain measurements using Fiber Bragg Grating (FBG) sensors embedded in metal parts. Using an ultrasonic... This article demonstrates high-frequency dynamic strain measurements using fiber Bragg grating (FBG) sensors embedded in metal parts. Using an ultrasonic... |
SourceID | osti proquest crossref ieee |
SourceType | Open Access Repository Aggregation Database Publisher |
StartPage | 1 |
SubjectTerms | Bragg gratings Coated fibers Dynamic Strain Measurement Embedded sensor Fiber Bragg Grating (FBG) Fiber gratings Finite element method High speed Interrogation Manufacturing MATERIALS SCIENCE Optical device fabrication Optical fiber measurement applications Optical fiber sensors Optical fibers Sensors Strain measurement Temperature measurement Temperature sensors Tunable lasers Ultrasonic Additive Manufacturing (UAM) Vertical cavity surface emission lasers Vertical cavity surface emitting lasers |
Title | Embedded Fiber Bragg Grating (FBG) Sensors Fabricated by Ultrasonic Additive Manufacturing for High-Frequency Dynamic Strain Measurements |
URI | https://ieeexplore.ieee.org/document/10370745 https://www.proquest.com/docview/2920286046 https://www.osti.gov/biblio/2283850 |
Volume | 24 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1Nb9QwEB2xvQCHAqWIpQX5wAGQvM2Hk9jHlm5aIbWXpVJvkT-3B8iiZPewP6H_mhknWyohDpySg2VZemPPjD3zHsBHadGn6gTTEiMyjgdewpVUBQ_CeYU5kQ9Ri-ByUV3fyvM50eTwh14Y730sPvMz-o1v-W5lN3RVdkI9bejyiglMKiWHZq2HJwNVRVpP3MEJF3l1Oz5hpok6-baYX89IJ3yW5yIvR1G2nROKqir4WeGe-utEjm6mfvGfC3wJ-2M8yU4HA3gFT3x7AM8fsQwewNNR6Pxu-xru5z-Nx7PGsZpKRdhZp5dLdkFm0C7Zp_rs4jNbYGa76npWaxM1hHCw2bKbH-tO90Sky06dixVH7Eq3G-qMiK2ODMNfRmUjvO6G-uwtOx_07tkiKlGwqz8Xkv0h3NTz718v-ajGwG2epWtuTJUEDJfKLHU22NwJV3rjMJ1LXWEMBoouDUF6DACCz4ikJug0dUJ6W0md6_wN7LWr1r8FpkxZoBFYK30lnLMm6MwLWahgbBqMmMKXHTzNr4F0o4nJSqIawrIhLJsRyykcEhCPBg4YTOGIEG0wkiA6XEt1Q3bdEN2PLJIpHO-AbsZd2zek3JVJnLN8949Jj-AZDhFD2fYx7K27jX8Pk95tPkRr_A1Q7t21 |
link.rule.ids | 230,315,782,786,798,887,27934,27935,54769 |
linkProvider | IEEE |
linkToHtml | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1Nb9QwEB3RcigcKJRWXVrABw6AlG0-nMQ5tnTTBbp72VbqzYq_toc2i5Ldw_4E_jUzTrathDhwSg6WZemNPTP2zHsAn4RGn1qFmJYoHgd44IVBIYo0cNzYAnMi67wWwXiWT2_E-YhocoKHXhhrrS8-s0P69W_5ZqFXdFV2Qj1t6PLSLXie8jwrunath0eDIvfEnriHw4An-U3_iBmFxcmP2Wg6JKXwYZLwJOtl2TZuyOuq4GeBu-qvM9k7mnL3P5f4Gl71ESU77UzgDTyz9R68fMIzuAc7vdT57fot_B7dK4unjWElFYuws6aaz9kFGUI9Z5_Ls4svbIa57aJpWVkpryKEg9WaXd8tm6olKl12aoyvOWKTql5Rb4RvdmQYADMqHAnKpqvQXrPzTvGezbwWBZs8Xkm2-3Bdjq6-jYNejyHQSRwtA6Xy0GHAlMWR0U4nhpvMKoMJXWRSpTBUNJFzwmII4GxMNDWuiiLDhdW5qJIqOYDtelHbQ2CFylI0A62FzbkxWrkqtlykhVM6cooP4OsGHvmro92QPl0JC0lYSsJS9lgOYJ-AeDKww2AAR4SoxFiCCHE1VQ7ppSTCH5GGAzjeAC37fdtK0u6KBc6ZvfvHpB9hZ3w1uZSX36c_j-AFDuddEfcxbC-blX0PW61ZffCW-QcjLuEI |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Embedded+Fiber+Bragg+Grating+%28FBG%29+Sensors+Fabricated+by+Ultrasonic+Additive+Manufacturing+for+High-Frequency+Dynamic+Strain+Measurements&rft.jtitle=IEEE+sensors+journal&rft.au=Zhao%2C+Jieru&rft.au=Dong%2C+Wen&rft.au=Hinds%2C+Thomas&rft.au=Li%2C+Yuqi&rft.date=2024-02-01&rft.pub=IEEE&rft.issn=1530-437X&rft.eissn=1558-1748&rft.spage=1&rft.epage=1&rft_id=info:doi/10.1109%2FJSEN.2023.3343604&rft.externalDocID=10370745 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1530-437X&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1530-437X&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1530-437X&client=summon |