Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate

Whisker growth from Sn coatings is a reliability concern in electronic packages, until recently mitigated by Pb addition. Recently, it was demonstrated that doping with In dramatically reduces whisker growth in 1 μ m thick Sn. Here, we present the results of In-doping on whisker growth from 3 μ m...

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Bibliographic Details
Published in:	Journal of electronic materials Vol. 46; no. 7; pp. 4062 - 4075
Main Authors:	Das Mahapatra, S., Majumdar, B. S., Dutta, I., Bhassyvasantha, S.
Format:	Journal Article
Language:	English
Published:	New York Springer US 01-07-2017 Springer Nature B.V
Subjects:	Alloys Auger spectroscopy Characterization and Evaluation of Materials Chemistry and Materials Science Coating Coatings Copper Diffusivity Doping Electron spectroscopy Electronics Electronics and Microelectronics Finite element method Indium Instrumentation Materials Materials Science Mathematical analysis Mathematical models Microstructure Modulus of elasticity Optical and Electronic Materials Packages Photoelectron spectroscopy Reliability Solid State Physics Substrates Thick films tin indium mitigation Whisker dopant
Online Access:	Get full text
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