Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates

Among many factors that influence whisker nucleation and growth in electroplated tin, it is now well established that small additions of Pb leads to whisker mitigation. To date, a good non-toxic elemental alternative to Pb that would mitigate whiskers remains elusive. In this work, a 50–100 nm In el...

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Bibliographic Details
Published in:	Journal of electronic materials Vol. 45; no. 1; pp. 791 - 801
Main Authors:	Meinshausen, L., Bhassyvasantha, S., Majumdar, B. S., Dutta, I.
Format:	Journal Article
Language:	English
Published:	New York Springer US 01-01-2016 Springer Nature B.V
Subjects:	Characterization and Evaluation of Materials Chemistry and Materials Science Copper Electronics and Microelectronics Indium Instrumentation Materials Science Optical and Electronic Materials Protective coatings Soldering Solid State Physics Substrates self-diffusion Tin indium mitigation whisker growth electroplating
Online Access:	Get full text
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