Structural and electrical characterisations of rapid thermal annealed thin silicon oxide films on silicon

An investigation of the structural and electrical properties of rapid thermal annealed silicon–silicon oxide (Si–SiO 2) systems has been carried out. The oxide thickness is between 200–500 Å. Infrared spectroscopy was used in the structural analysis. The electrical characterisations were carried out...

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Bibliographic Details
Published in:Thin solid films Vol. 317; no. 1; pp. 219 - 222
Main Authors: Chan, Y.M, Choo, C.K, Choi, W.K
Format: Journal Article Conference Proceeding
Language:English
Published: Lausanne Elsevier B.V 01-04-1998
Elsevier Science
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Summary:An investigation of the structural and electrical properties of rapid thermal annealed silicon–silicon oxide (Si–SiO 2) systems has been carried out. The oxide thickness is between 200–500 Å. Infrared spectroscopy was used in the structural analysis. The electrical characterisations were carried out using the capacitance versus voltage ( C– V) and the conductance versus voltage ( G– V) methods. For the thermal oxides samples, it was found that in general, there is an increase in the number of fixed charges ( N f) after rapid thermal annealing (RTA). Sample annealed at 700°C shows an increase in the interface trap density ( D it) as compared to the as-grown sample. For samples annealed at 900°C and above, the D it decreased as compared with the unannealed sample. For oxides prepared with the r.f. sputtering technique, it was observed that the as-prepared sample was very leaky and it was not possible to carry out the C– V or G– V measurements. However, after RTA the insulating property and D it of the sputtered oxides improved significantly.
Bibliography:SourceType-Scholarly Journals-2
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ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(97)00518-X