Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

Heterogeneous integration is a key driver within the field of advanced electronic packaging. The realization of tomorrow’s highly integrated electronic systems depends on the combination and compatibility of various integration technologies at the same hierarchy level. The adoption of novel bonding...

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Bibliographic Details
Published in:	Journal of electronic materials Vol. 53; no. 8; pp. 4410 - 4420
Main Authors:	Bickel, Steffen, Quednau, Sebastian, Birlem, Olav, Graff, Andreas, Altmann, Frank, Junghähnel, Manuela, Panchenko, Juliana
Format:	Journal Article
Language:	English
Published:	New York Springer US 01-08-2024 Springer Nature B.V
Subjects:	17th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics 2023 Bonding strength Characterization and Evaluation of Materials Chemistry and Materials Science Copper Electronic packaging Electronic systems Electronics and Microelectronics Instrumentation Interconnections Materials Science Microstructure Nanowires Optical and Electronic Materials Room temperature Shear strength Shear tests Solid State Physics Surface preparation System effectiveness Topical Collection: Reliability and Stress-Related Phenomena in Nanoelectronics 2023 Heterogeneous integration TEM thermocompression bonding Cu–Cu EBSD nanowire
Online Access:	Get full text
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