Off-state degradation with ac bias in PMOSFET

For the first time, the current failure of p-channel MOSFETs used for the sub-wordline driver of state-of-the-art DRAM chips was investigated during off-state switching cycles. With increasing switching speed for the sub-wordline driver, the subthreshold leakage current of p-channel MOSFETs increase...

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Published in:Microelectronics and reliability Vol. 65; pp. 16 - 19
Main Authors: Park, Segeun, Jung, Hyuckchai, Oh, Jeonghoon, Kim, Ilgweon, Hong, Hyoungsun, Jin, Gyoyoung, Roh, Yonghan
Format: Journal Article
Language:English
Published: Elsevier Ltd 01-10-2016
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Abstract For the first time, the current failure of p-channel MOSFETs used for the sub-wordline driver of state-of-the-art DRAM chips was investigated during off-state switching cycles. With increasing switching speed for the sub-wordline driver, the subthreshold leakage current of p-channel MOSFETs increased, and resulted in serious stand-by current failure. The model proposed in this work suggested that the off-state degradation of p-channel MOSFETs with ac bias will intensify as the dimensions of devices decrease due to both the high electric field and the high operating frequency. The roles of various device parameters- such as gate length, gate-tab width, doping concentration at the source/drain extensions, operating temperature and operating frequency- on the degradation of p-channel MOSFETs were investigated. •For the first time, off-state degradation with ac bias in PMOS is investigated.•The sub-threshold leakage current of PMOS increased after off-state degradation with ac bias.•We suggested the degradation model of off-state degradation with ac bias.•The roles of various device parameters on the degradation of p-channel MOSFETs were investigated.
AbstractList For the first time, the current failure of p-channel MOSFETs used for the sub-wordline driver of state-of-the-art DRAM chips was investigated during off-state switching cycles. With increasing switching speed for the sub-wordline driver, the subthreshold leakage current of p-channel MOSFETs increased, and resulted in serious stand-by current failure. The model proposed in this work suggested that the off-state degradation of p-channel MOSFETs with ac bias will intensify as the dimensions of devices decrease due to both the high electric field and the high operating frequency. The roles of various device parameters- such as gate length, gate-tab width, doping concentration at the source/drain extensions, operating temperature and operating frequency- on the degradation of p-channel MOSFETs were investigated. •For the first time, off-state degradation with ac bias in PMOS is investigated.•The sub-threshold leakage current of PMOS increased after off-state degradation with ac bias.•We suggested the degradation model of off-state degradation with ac bias.•The roles of various device parameters on the degradation of p-channel MOSFETs were investigated.
Author Park, Segeun
Hong, Hyoungsun
Jung, Hyuckchai
Kim, Ilgweon
Jin, Gyoyoung
Roh, Yonghan
Oh, Jeonghoon
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  organization: College of Information and Communication Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do 440-746, Republic of Korea
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Keywords ac bias
Hot electron
PMOSFET
HEIP
Off-state
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References Koyanagi, Lewis, Martin, Huang, Chen (bb0005) 1987; 34
Cho, Spessot, Kaczer, Aoulaiche, Ritzenthaler, Schram, Fazan, Horiguchi, Linten (bb0015) 2015
Spessot, Aoulaiche, Cho, Franco, Schram, Ritzenthaler, kaczer (bb0020) 2014
Seo, Park, Lee, Kang, Kang, Kwak, Lee (bb0025) 2009
Lee, Kim, Kang (bb0040) 2012; 33
Lee, Baek, Kang (bb0035) 2011; 32
Holzhauser, Narr (bb0030) 2000
Lee, lee, Jeong, Chung, Kim (bb0010) 2001
Varghese, Reddy, Shidhijo, Msosher, Krishnan, Alam (bb0045) 2008
Pin, Goto, Sugii, Hu (bb0050) 2002; 23
Hong, Jin, Seo, Lee, Song, Noh, Oh, Kim, Kim, Kim, Won, Lee, Song, Lee, Lee (bb0060) 2002
Sano, Tomizawa, Yoshii (bb0055) 1995; 42
Sano (10.1016/j.microrel.2016.08.007_bb0055) 1995; 42
Seo (10.1016/j.microrel.2016.08.007_bb0025) 2009
Koyanagi (10.1016/j.microrel.2016.08.007_bb0005) 1987; 34
Pin (10.1016/j.microrel.2016.08.007_bb0050) 2002; 23
Varghese (10.1016/j.microrel.2016.08.007_bb0045) 2008
Cho (10.1016/j.microrel.2016.08.007_bb0015) 2015
Lee (10.1016/j.microrel.2016.08.007_bb0035) 2011; 32
Holzhauser (10.1016/j.microrel.2016.08.007_bb0030) 2000
Spessot (10.1016/j.microrel.2016.08.007_bb0020) 2014
Lee (10.1016/j.microrel.2016.08.007_bb0040) 2012; 33
Lee (10.1016/j.microrel.2016.08.007_bb0010) 2001
Hong (10.1016/j.microrel.2016.08.007_bb0060) 2002
References_xml – volume: 34
  start-page: 839
  year: 1987
  end-page: 844
  ident: bb0005
  article-title: Hot-electron-induced punch through (HEIP) effect in submicrometer PMOSFET's
  publication-title: IEEE Trans. Electron Device
  contributor:
    fullname: Chen
– start-page: 467
  year: 2001
  end-page: 470
  ident: bb0010
  article-title: Investigation of Pmosfet hot electron induced punch through (HEIP) in shallow trench isolation
  publication-title: Proc. European Solid-State Device Research Conference
  contributor:
    fullname: Kim
– volume: 42
  start-page: 2211
  year: 1995
  end-page: 2216
  ident: bb0055
  article-title: Temperature dependence of hot carrier effects in short-channel
  publication-title: IEEE Trans. Electron Device
  contributor:
    fullname: Yoshii
– start-page: 1
  year: 2015
  end-page: 4
  ident: bb0015
  article-title: Off-state degradation mechanism on advanced p-MOSFETs
  publication-title: Int. Conference on IC Design & Technology
  contributor:
    fullname: Linten
– volume: 33
  start-page: 137
  year: 2012
  end-page: 139
  ident: bb0040
  article-title: Impact of off-state stress and negative bias temperature instability on degradation of nanoscale Pmosfet
  publication-title: IEEE Electron Device Lett.
  contributor:
    fullname: Kang
– volume: 23
  start-page: 550
  year: 2002
  end-page: 552
  ident: bb0050
  article-title: A thermal activation view of low voltage impact ionization in MOSFETs
  publication-title: IEEE Electron Device Lett.
  contributor:
    fullname: Hu
– start-page: 283
  year: 2002
  end-page: 286
  ident: bb0060
  article-title: Evaluation of STI degradation causing DRAM standby current failure in burn-in mode operation using a carrier injection method
  publication-title: Proc. IRPS Tech. Dig
  contributor:
    fullname: Lee
– start-page: 566
  year: 2008
  end-page: 574
  ident: bb0045
  article-title: A comprehensive analysis of off-state stress in drain extended PMOS transistors: theory and characterization of parametric degradation and dielectric failure
  publication-title: Proc, IRPS Tech. Dig
  contributor:
    fullname: Alam
– start-page: 365
  year: 2014
  end-page: 368
  ident: bb0020
  article-title: Impact of off state stress on advanced high-K metal gate NMOSFETs
  publication-title: Proc. ESSDERC Dig
  contributor:
    fullname: kaczer
– start-page: 969
  year: 2009
  end-page: 970
  ident: bb0025
  article-title: Layout dependency of PMOS off current degradation due to off-state stress
  publication-title: Proc. IRPS Tech. Dig
  contributor:
    fullname: Lee
– start-page: 158
  year: 2000
  end-page: 160
  ident: bb0030
  article-title: Off-state-degradation of 170
  publication-title: Proc. IRW Final Report
  contributor:
    fullname: Narr
– volume: 32
  start-page: 856
  year: 2011
  end-page: 858
  ident: bb0035
  article-title: Effect of off-state stress and drain relaxation voltage on degradation of a nanoscale Nmosfet at high temperature
  publication-title: IEEE Electron Device Lett.
  contributor:
    fullname: Kang
– start-page: 365
  year: 2014
  ident: 10.1016/j.microrel.2016.08.007_bb0020
  article-title: Impact of off state stress on advanced high-K metal gate NMOSFETs
  contributor:
    fullname: Spessot
– volume: 32
  start-page: 856
  issue: 7
  year: 2011
  ident: 10.1016/j.microrel.2016.08.007_bb0035
  article-title: Effect of off-state stress and drain relaxation voltage on degradation of a nanoscale Nmosfet at high temperature
  publication-title: IEEE Electron Device Lett.
  doi: 10.1109/LED.2011.2145350
  contributor:
    fullname: Lee
– volume: 34
  start-page: 839
  issue: 4
  year: 1987
  ident: 10.1016/j.microrel.2016.08.007_bb0005
  article-title: Hot-electron-induced punch through (HEIP) effect in submicrometer PMOSFET's
  publication-title: IEEE Trans. Electron Device
  doi: 10.1109/T-ED.1987.23004
  contributor:
    fullname: Koyanagi
– volume: 33
  start-page: 137
  issue: 2
  year: 2012
  ident: 10.1016/j.microrel.2016.08.007_bb0040
  article-title: Impact of off-state stress and negative bias temperature instability on degradation of nanoscale Pmosfet
  publication-title: IEEE Electron Device Lett.
  doi: 10.1109/LED.2011.2174026
  contributor:
    fullname: Lee
– start-page: 158
  year: 2000
  ident: 10.1016/j.microrel.2016.08.007_bb0030
  article-title: Off-state-degradation of 170nm and 140nm buried LDD pMOSFETs with different HALO implants
  contributor:
    fullname: Holzhauser
– start-page: 969
  year: 2009
  ident: 10.1016/j.microrel.2016.08.007_bb0025
  article-title: Layout dependency of PMOS off current degradation due to off-state stress
  contributor:
    fullname: Seo
– start-page: 283
  year: 2002
  ident: 10.1016/j.microrel.2016.08.007_bb0060
  article-title: Evaluation of STI degradation causing DRAM standby current failure in burn-in mode operation using a carrier injection method
  contributor:
    fullname: Hong
– start-page: 1
  year: 2015
  ident: 10.1016/j.microrel.2016.08.007_bb0015
  article-title: Off-state degradation mechanism on advanced p-MOSFETs
  contributor:
    fullname: Cho
– volume: 42
  start-page: 2211
  issue: 12
  year: 1995
  ident: 10.1016/j.microrel.2016.08.007_bb0055
  article-title: Temperature dependence of hot carrier effects in short-channel Si-MOSFET's
  publication-title: IEEE Trans. Electron Device
  doi: 10.1109/16.477781
  contributor:
    fullname: Sano
– start-page: 566
  year: 2008
  ident: 10.1016/j.microrel.2016.08.007_bb0045
  article-title: A comprehensive analysis of off-state stress in drain extended PMOS transistors: theory and characterization of parametric degradation and dielectric failure
  contributor:
    fullname: Varghese
– start-page: 467
  year: 2001
  ident: 10.1016/j.microrel.2016.08.007_bb0010
  article-title: Investigation of Pmosfet hot electron induced punch through (HEIP) in shallow trench isolation
  contributor:
    fullname: Lee
– volume: 23
  start-page: 550
  issue: 23
  year: 2002
  ident: 10.1016/j.microrel.2016.08.007_bb0050
  article-title: A thermal activation view of low voltage impact ionization in MOSFETs
  publication-title: IEEE Electron Device Lett.
  doi: 10.1109/LED.2002.802653
  contributor:
    fullname: Pin
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Snippet For the first time, the current failure of p-channel MOSFETs used for the sub-wordline driver of state-of-the-art DRAM chips was investigated during off-state...
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StartPage 16
SubjectTerms ac bias
HEIP
Hot electron
Off-state
PMOSFET
Title Off-state degradation with ac bias in PMOSFET
URI https://dx.doi.org/10.1016/j.microrel.2016.08.007
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