The effect of copper coated metal hydride at different ratios on the reaction kinetics

• Published in: International journal of hydrogen energy Vol. 48; no. 60; pp. 23067 - 23076
• Main Authors: Atalmis, Gamze, Demiralp, Mehmet, Yelegen, Nebi, Kaplan, Yuksel
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 15-07-2023
• Subjects: Hydrogen storage; Metal hydride; Thermal conductivity; Thermal conductivity; Hydrogen storage; Metal hydride
• ISSN: 0360-3199; 1879-3487
• DOI: 10.1016/j.ijhydene.2022.12.078

In this study, the process parameters that affect the improvement of hydrogen storage material properties were investigated. In order to accelerate the hydrogen charge/discharge processes and to obtain the required hydrogen at the desired flow rates in a short time, the thermal conductivity of the storage materials has been improved, and density analyses have been made. The ideal grinding time has been determined for the LaNi5 material. Within the scope of the experimental studies, the thermal conductivity coefficients of LaNi5 coated with copper and LaNi5 ground for 5 h and coated with copper were increased by 500–750%, and the copper plating ratios were optimized. The materials obtained were characterized by XRD, SEM, and their density was measured with the Helium Pyknometer device and their thermal conductivity coefficients with the Hot Disk Thermal Constants Analyzer. In addition, the hydrogen storage of materials with increased thermal conductivity was investigated experimentally in the metal hydride reactor at the determined pressure. In the study, it was seen that the storage material coated with copper increases the heat transfer, reduces the hydrogen charging time in the metal hydride reactor, and increases the stable discharge time.
•A method was developed for the thermal conductivity enhancement of LaNi5 powder.•Effective thermal conductivity of LaNi5 during hydride/dehydride was studied.•Copper-coated LaNi5 has low-cost heat storage potential.•Heat transfer coefficients of storage materials were improved with copper additive.