AMD Fusion APU: Llano

The Llano variant of the AMD Fusion accelerated processor unit (APU) deploys AMD Turbo CORE technology to maximize processor performance within the system's thermal design limits. Low-power design and performance/watt ratio optimization were key design approaches, and power gating is implemente...

Full description

Saved in:
Bibliographic Details
Published in:IEEE MICRO Vol. 32; no. 2; pp. 28 - 37
Main Authors: Branover, A., Foley, D., Steinman, M.
Format: Journal Article
Language:English
Published: Los Alamitos IEEE 01-03-2012
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Abstract The Llano variant of the AMD Fusion accelerated processor unit (APU) deploys AMD Turbo CORE technology to maximize processor performance within the system's thermal design limits. Low-power design and performance/watt ratio optimization were key design approaches, and power gating is implemented pervasively across the APU.
AbstractList The Llano variant of the AMD Fusion accelerated processor unit (APU) deploys AMD Turbo CORE technology to maximize processor performance within the system's thermal design limits. Low-power design and performance/watt ratio optimization were key design approaches, and power gating is implemented pervasively across the APU.
The Llano variant of the AMD Fusion accelerated processor unit (APU) deploys AMD Turbo CORE technology to maximize processor performance within the system's thermal design limits. Low-power design and performance/watt ratio optimization were key design approaches, and power gating is implemented pervasively across the APU. [PUBLICATION ABSTRACT]
Author Foley, D.
Steinman, M.
Branover, A.
Author_xml – sequence: 1
  givenname: A.
  surname: Branover
  fullname: Branover, A.
  email: alex.branover@amd.com
– sequence: 2
  givenname: D.
  surname: Foley
  fullname: Foley, D.
– sequence: 3
  givenname: M.
  surname: Steinman
  fullname: Steinman, M.
BookMark eNpd0L1PwzAQBXALFYm2MDAwsVRigSHl7uwkNltVPqVGMNDZch1bStXGJW4G_ntcFTEw3fLTvac3YoM2tI6xS4QpIqj7qpoSIE3phA1R8TITKPiADYFKyrDkdMZGMa4BICeQQ3Y1qx4nz31sQjuZfSwfJouNacM5O_VmE93F7x2z5fPT5_w1W7y_vM1ni8xyhH1Wc-9VnteQCwe18jJlgTWSe1mDkuRUreyKqPbkC1uuSmmEd9IWFo1HY_iY3R7_7rrw1bu419smWrdJHVzoo0Ygkgq4wkRv_tF16Ls2tUsquUJwkSd1d1S2CzF2zutd12xN952QPgykq0ofBtKU7PXRNs65P1cgl1Jw_gNSTF6k
CODEN IEMIDZ
CitedBy_id crossref_primary_10_1109_MDAT_2013_2274651
crossref_primary_10_1587_transele_E96_C_528
crossref_primary_10_1109_TC_2015_2512860
crossref_primary_10_1109_TKDE_2020_2975652
crossref_primary_10_1016_j_jss_2016_02_009
crossref_primary_10_1007_s11227_018_2525_0
crossref_primary_10_1016_j_amc_2015_03_072
crossref_primary_10_1007_s11390_015_1510_9
crossref_primary_10_1145_3485126
crossref_primary_10_1109_ACCESS_2019_2910932
crossref_primary_10_1007_s10766_018_0617_3
crossref_primary_10_1016_j_future_2014_12_014
crossref_primary_10_1145_2788396
crossref_primary_10_1145_2644865_2541956
crossref_primary_10_1145_2678373_2665702
crossref_primary_10_1145_2659000
crossref_primary_10_1109_TVLSI_2017_2759219
crossref_primary_10_1109_ACCESS_2020_2986335
crossref_primary_10_1109_TC_2012_286
crossref_primary_10_1109_TPDS_2015_2453965
crossref_primary_10_1016_j_suscom_2013_11_001
crossref_primary_10_1145_2654822_2541956
crossref_primary_10_1002_cpe_8147
crossref_primary_10_1145_2678373_2665709
crossref_primary_10_1016_j_micpro_2014_06_007
crossref_primary_10_1016_j_jcss_2014_06_017
crossref_primary_10_1016_j_jpdc_2015_06_010
crossref_primary_10_1145_3330152
crossref_primary_10_1109_TMC_2021_3139940
crossref_primary_10_1016_j_parco_2015_04_004
crossref_primary_10_1007_s10586_017_1295_4
crossref_primary_10_1016_j_future_2017_02_012
crossref_primary_10_1109_MM_2014_3
crossref_primary_10_3390_electronics9111825
crossref_primary_10_1007_s00500_017_2786_1
crossref_primary_10_1007_s42514_019_00008_6
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Mar/Apr 2012
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Mar/Apr 2012
DBID 97E
RIA
RIE
AAYXX
CITATION
7SC
7SP
8FD
JQ2
L7M
L~C
L~D
F28
FR3
DOI 10.1109/MM.2012.2
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library Online
CrossRef
Computer and Information Systems Abstracts
Electronics & Communications Abstracts
Technology Research Database
ProQuest Computer Science Collection
Advanced Technologies Database with Aerospace
Computer and Information Systems Abstracts – Academic
Computer and Information Systems Abstracts Professional
ANTE: Abstracts in New Technology & Engineering
Engineering Research Database
DatabaseTitle CrossRef
Technology Research Database
Computer and Information Systems Abstracts – Academic
Electronics & Communications Abstracts
ProQuest Computer Science Collection
Computer and Information Systems Abstracts
Advanced Technologies Database with Aerospace
Computer and Information Systems Abstracts Professional
Engineering Research Database
ANTE: Abstracts in New Technology & Engineering
DatabaseTitleList Technology Research Database

Technology Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: http://ieeexplore.ieee.org/Xplore/DynWel.jsp
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Computer Science
EISSN 1937-4143
EndPage 37
ExternalDocumentID 2647100911
10_1109_MM_2012_2
6138843
Genre orig-research
Feature
GroupedDBID -DZ
-~X
.DC
0R~
29I
3EH
4.4
5GY
5VS
6IK
97E
AAJGR
AASAJ
AAYOK
ABQJQ
ABVLG
ACGFO
ACGFS
ACGOD
ACIWK
ACNCT
AENEX
AETEA
AETIX
AI.
AIBXA
AKJIK
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ASUFR
ATWAV
AZLTO
BEFXN
BFFAM
BGNUA
BKEBE
BKOMP
BPEOZ
C1A
CS3
DU5
EBS
EJD
HZ~
H~9
IBMZZ
ICLAB
IEDLZ
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
MS~
O9-
OCL
OHT
P2P
PQQKQ
RIA
RIC
RIE
RIG
RNI
RNS
RZB
TAE
TN5
TWZ
VH1
XFK
YZZ
ZCG
AAYXX
CITATION
7SC
7SP
8FD
JQ2
L7M
L~C
L~D
F28
FR3
ID FETCH-LOGICAL-c310t-d3ff955d054e0d9f81430ca83f8d0982e9d9cb22df2f6c7b78a4fe8c6c1af1aa3
IEDL.DBID RIE
ISSN 0272-1732
IngestDate Sat Oct 26 01:08:23 EDT 2024
Thu Oct 10 16:25:24 EDT 2024
Thu Sep 26 19:49:01 EDT 2024
Wed Jun 26 19:29:02 EDT 2024
IsPeerReviewed true
IsScholarly true
Issue 2
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c310t-d3ff955d054e0d9f81430ca83f8d0982e9d9cb22df2f6c7b78a4fe8c6c1af1aa3
Notes ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
PQID 1010264345
PQPubID 37061
PageCount 10
ParticipantIDs proquest_miscellaneous_1022890391
ieee_primary_6138843
proquest_journals_1010264345
crossref_primary_10_1109_MM_2012_2
PublicationCentury 2000
PublicationDate 2012-March-April
2012-03-00
20120301
PublicationDateYYYYMMDD 2012-03-01
PublicationDate_xml – month: 03
  year: 2012
  text: 2012-March-April
PublicationDecade 2010
PublicationPlace Los Alamitos
PublicationPlace_xml – name: Los Alamitos
PublicationTitle IEEE MICRO
PublicationTitleAbbrev MM
PublicationYear 2012
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References (ref1) 2009; 4 0
References_xml – volume: 4 0
  year: 2009
  ident: ref1
  publication-title: Advanced configuration and power interface specification
SSID ssj0005208
Score 2.36153
Snippet The Llano variant of the AMD Fusion accelerated processor unit (APU) deploys AMD Turbo CORE technology to maximize processor performance within the system's...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Publisher
StartPage 28
SubjectTerms Acceleration
AMD Fusion
APU
Computer architecture
Decoding
Design engineering
energy-aware systems
Gating and risering
Graphics
Graphics processing unit
integrated graphics
low-power design
Microprocessors
Monitoring
Optimization
Process control
Streaming media
Thermal design
Title AMD Fusion APU: Llano
URI https://ieeexplore.ieee.org/document/6138843
https://www.proquest.com/docview/1010264345
https://search.proquest.com/docview/1022890391
Volume 32
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LT4NAEJ7Ynrz4ao1oNWg8ui0sC8x6a2ybHsSYaBNvZJ8nA8aW_y8LtNHoxRsJm12Yfcy3M9_MANzGBjlTMSUSTUyYYJxIKQVB6-IkhQoT5YKTly_p0xvO5i5Nzt0uFsYY05DPzNg9Nr58XarKmcomtepBZFEPeinHNlbrO52jOXVpSkmYRrTLIhQGfJJljsJFx_SH7mmKqfw6gRu1sjj83wcdwUEHH_1pO9_HsGeKEzjclmbwu506gOE0m_mLypnC_Onz6t5_fBdFOYTVYv76sCRdBQSiati1ITqylsexrnGVCTS3WKObQAmMLOqAIzVccyUp1ZbaRKUyRcGsQZWoUNhQiOgU-kVZmDPwQ2qQGVv3JJBpiTXSUiaSSCVlNky0Bzdb2eQfbaKLvLkgBDzPstwJMKceDJwQdg26__dgtJVi3m2BteOO1fc7FrHYg-vd63rxOo-EKExZuTbUOTojHp7_3fMF7LuRW9LXCPqbz8pcQm-tq6tm-r8AL8-sGQ
link.rule.ids 315,782,786,798,27933,27934,54767
linkProvider IEEE
linkToHtml http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwED5BGWChQIsIFAiIkbSJ7SQ2W0VbFdFUSLQSW-TnhBJEm_9PnKQVCBY2S7Ys-_y4z77v7gDuQk0ZkSHyBNWhRzhhnhCCe9RYP0kug0ha5-Tpazx_o6OxDZNzv_WF0VpX5DPdt8XKlq9yWdivskGpeigleBf2QhJHce2t9Z3QUd27KEZeEGPUxBEKfDZIEkviQn30Q_tU6VR-3cGVYpm0_zekIzhsAKQ7rFf8GHZ0dgLtTXIGtzmrHegOk5E7KexnmDt8WT64s3ee5V1YTsaLx6nX5EDwZAm81p7CxrAwVCWy0r5ihpb4xpecYkOVzyjSTDEpEFIGmUjGIqacGE1lJANuAs7xKbSyPNNn4AZIU6JN2ROnRAlaYi2psaBIIGKCSDlwu5FN-lGHukirJ4LP0iRJrQBT5EDHCmHboJm_A72NFNPmEKwse6x84RFMQgduttXl9rU2CZ7pvLBtkDV1Yhac_93zNexPF8ksnT3Nny_gwI6ipoD1oLX-LPQl7K5UcVVthS9xza9q
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=AMD+Fusion+APU%3A+Llano&rft.jtitle=IEEE+MICRO&rft.au=Branover%2C+A.&rft.au=Foley%2C+D.&rft.au=Steinman%2C+M.&rft.date=2012-03-01&rft.pub=IEEE&rft.issn=0272-1732&rft.eissn=1937-4143&rft.volume=32&rft.issue=2&rft.spage=28&rft.epage=37&rft_id=info:doi/10.1109%2FMM.2012.2&rft.externalDocID=6138843
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0272-1732&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0272-1732&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0272-1732&client=summon