Analysis of Magnetic Field and Discharge Plasma for HTS Magnetron Sputtering Apparatus
The magnetron sputtering apparatus with high magnetic field could be used to fabricate special films. In order to investigate the typical plasma distribution of high field magnetron and further improve the film quality, a newly HTS (high temperature superconductivity) rectangular planar magnetron wi...
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Published in: | IEEE transactions on applied superconductivity Vol. 20; no. 3; pp. 1017 - 1020 |
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Main Authors: | , , , , |
Format: | Journal Article Conference Proceeding |
Language: | English |
Published: |
New York, NY
IEEE
01-06-2010
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
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Summary: | The magnetron sputtering apparatus with high magnetic field could be used to fabricate special films. In order to investigate the typical plasma distribution of high field magnetron and further improve the film quality, a newly HTS (high temperature superconductivity) rectangular planar magnetron with racetrack type coil is proposed. The magnetic field in the discharge space is calculated by finite element method, and it is one order higher than that of conventional magnetrons. Based on this, the simulation of magnetron discharge plasma is performed with PIC-MCC (particle-in-cell, Monte Carlo collision) method. The simulation results show that a large electric field region is formed in high magnetic field. Due to the additional electric field, the plasma is broadened to anode direction. Through theoretical analysis, magnetic field and plasma simulation, the disadvantages of current HTS magnetron are further pointed out, and it is discussed how to improve the HTS magnetron. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 1051-8223 1558-2515 |
DOI: | 10.1109/TASC.2010.2044567 |