Comparative thermal performance evaluation of a heat sink based on geometrical and material amendments: A numerical study

• Published in: Materials today : proceedings Vol. 50; pp. 816 - 822
• Main Authors: Aryan Saini, Raj, Vohra, Minesh, Singh, Arpit, Rabbani, Tarique, Choudhary, Mohit
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01-01-2022
• Subjects: Electronic cooling; Heat transfer; Heatsink design; Material efficacy; Heatsink design; Material efficacy; Electronic cooling; Heat transfer
• DOI: 10.1016/j.matpr.2021.06.029
• EISSN: 2214-7853

The study focuses on the design and materialistic amendments for thermal performance evaluation of a heat sink which is a just modified version of the conventional heat sink used for processor Ryzen 5 3600, introduced by a company named Advanced Micro Devices (AMD) for cooling applications in High-Performance Gaming PCs. The enhancement of the cooling strategy is achieved within dimensional and cost constraints by modifying the parametric dimensions, increasing the surface area, and introducing metal to the air-fluid boundary layer aspects into it. In this study, the heat sink is designed with a core of cylindrical shape, keeping a height of 20 mm and a diameter of 90 mm. Also, the universal dimensional compatibility of this heat sink is considered for the performance evaluation, followed by design and angle of air-fin interaction, swapped center rectangle shape with a frustum to decrease the thermal hindrance and to increase the surface area without any increment in overall volume. Moreover, the fin density in the module of the heat sink has also been increased to enhance the convective heat transfer strategy from the surface. Both designing & simulation have been carried out on the FEM tool Autodesk Fusion 360 and based on the numerical investigation on the modified design as per the conventional design, although our design is much more complex to manufacture in the first place. It has been observed that the new design is capable of providing 64.23% convective heat dissipation from the surface as well as able to reduce 50.9% of CPU surface temperature in comparison to the existing design of heat sink.