Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection

•Heat transfer from seven non-identical IC chips mounted on a SMPS board under mixedconvection.•Optimal arrangement of these heat sources using hybrid optimization strategy.•Use of numerical data driven ANN-GA technique to predict the optimal distribution.•Temperature of heat sources is a strong fun...

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Bibliographic Details

Published in:	Thermal science and engineering progress Vol. 7; pp. 221 - 229
Main Authors:	Mathew, V.K., Hotta, Tapano Kumar
Format:	Journal Article
Language:	English
Published:	Elsevier Ltd 01-09-2018
Subjects:	ANSYS Icepack Artificial neural network Genetic algorithm IC chips Mixed convection Optimal configuration Optimal configuration Artificial neural network Mixed convection Genetic algorithm ANSYS Icepack IC chips
Online Access:	Get full text
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