Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 10; no. 2; pp. 304 - 313
• Main Authors: Che, Fa Xing, Yamamoto, Kazunori, Rao, Vempati Srinivasa, Sekhar, Vasarla Nagendra
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01-02-2020; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Chemicals; Computer simulation; Design optimization; Electromagnetic compatibility; Fan-out (FO) technology; Finite element method; finite-element modeling; FO panel-level packaging (FO-PLP); Glass; Gravitation; Gravitational effects; Gravity; gravity effect; Load modeling; Materials selection; Molding (process); Molding compounds; Packaging; panel warpage; panel-level packaging; Parameter identification; Photoelectric effect; Semiconductor device modeling; Simulation; Taguchi methods; Technology utilization; Warpage
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2019.2929529

In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm × 650 mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panelwarpage simulation to achieve accurate simulation results.