3D Shape Sensing With FBG-Based Patch: From the Idea to the Device
In this work, the advantages of 3D printing technology are combined with fiber Bragg grating (FBG) sensors to implement an innovative 3D shape sensor embedded in a 3D printed patch. The system allows to obtain a sensing patch able to provide a direct measure of curvature and neutral axis position in...
Saved in:
Published in: | IEEE sensors journal Vol. 22; no. 2; pp. 1338 - 1345 |
---|---|
Main Authors: | , , , |
Format: | Journal Article |
Language: | English |
Published: |
New York
IEEE
15-01-2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Abstract | In this work, the advantages of 3D printing technology are combined with fiber Bragg grating (FBG) sensors to implement an innovative 3D shape sensor embedded in a 3D printed patch. The system allows to obtain a sensing patch able to provide a direct measure of curvature and neutral axis position in the 3D space in a simple manner and without requiring numerical simulations or mathematical models of the structure of interest. The experimental tests assess the proposed novel approach showing an optimal agreement between the measurements of the proposed patch with respect to the reference sensors. Furthermore, both the curvature sensitivity and resolution can be modulated by changing the distances among the FBGs inside the patch, tailoring the performances and the dimensions with the application requirements. |
---|---|
AbstractList | In this work, the advantages of 3D printing technology are combined with fiber Bragg grating (FBG) sensors to implement an innovative 3D shape sensor embedded in a 3D printed patch. The system allows to obtain a sensing patch able to provide a direct measure of curvature and neutral axis position in the 3D space in a simple manner and without requiring numerical simulations or mathematical models of the structure of interest. The experimental tests assess the proposed novel approach showing an optimal agreement between the measurements of the proposed patch with respect to the reference sensors. Furthermore, both the curvature sensitivity and resolution can be modulated by changing the distances among the FBGs inside the patch, tailoring the performances and the dimensions with the application requirements. |
Author | Di Palma, Pasquale Iadicicco, Agostino De Vita, Elena Campopiano, Stefania |
Author_xml | – sequence: 1 givenname: Pasquale orcidid: 0000-0001-9757-8228 surname: Di Palma fullname: Di Palma, Pasquale email: pasquale.dipalma@uniparthenope.it organization: Department of Engineering, University of Naples Parthenope, Naples, Italy – sequence: 2 givenname: Elena orcidid: 0000-0003-4975-2775 surname: De Vita fullname: De Vita, Elena email: elena.devita001@studenti.uniparthenope.it organization: Department of Engineering, University of Naples Parthenope, Naples, Italy – sequence: 3 givenname: Agostino orcidid: 0000-0002-3540-7316 surname: Iadicicco fullname: Iadicicco, Agostino email: iadicicco@uniparthenope.it organization: Department of Engineering, University of Naples Parthenope, Naples, Italy – sequence: 4 givenname: Stefania orcidid: 0000-0002-2987-9122 surname: Campopiano fullname: Campopiano, Stefania email: campopiano@uniparthenope.it organization: Department of Engineering, University of Naples Parthenope, Naples, Italy |
BookMark | eNo9kMtKw0AUhgepYFt9AHEz4DpxzlwyiTt7tVJUqKK7YTo5MSk2qZlU8O1NbHF1fg7_Bb4B6ZVViYRcAgsBWHLzsJo-hpxxCAUIoZk8IX1QKg5Ay7jXacECKfT7GRl4v2EMEq10n4zEhK5yu0O6wtIX5Qd9K5qczkbzYGQ9pvTZNi6_pbO62tImR7pI0dKm-tMT_C4cnpPTzH56vDjeIXmdTV_G98Hyab4Y3y0DxxPRBBLWjGsVR2qtuALpdJbpzPLISaGSyDErOTLmpOaQxjZLpWzfGRex4gzTWAzJ9aF3V1dfe_SN2VT7umwnDY8gYVxCrFoXHFyurryvMTO7utja-scAMx0q06EyHSpzRNVmrg6ZAhH__UnUFYL4BaE9Yl8 |
CODEN | ISJEAZ |
CitedBy_id | crossref_primary_10_1016_j_optlastec_2023_109119 crossref_primary_10_1016_j_optlastec_2023_109752 crossref_primary_10_1109_JSEN_2023_3269661 crossref_primary_10_2139_ssrn_4182778 crossref_primary_10_1016_j_yofte_2023_103618 crossref_primary_10_1016_j_yofte_2024_103849 crossref_primary_10_1109_JSEN_2022_3226039 crossref_primary_10_1109_JSEN_2023_3341433 crossref_primary_10_3390_app14051895 crossref_primary_10_1109_TIM_2023_3268466 |
Cites_doi | 10.1364/OL.40.001468 10.1038/srep17415 10.1109/JLT.2017.2764951 10.1016/j.optlaseng.2020.106508 10.1007/s13320-020-0579-0 10.1016/B978-0-12-819535-2.00010-7 10.1364/OE.24.025211 10.1088/2040-8978/18/8/085705 10.1364/OL.39.003508 10.1109/JSEN.2016.2584141 10.1016/j.yofte.2016.09.008 10.1109/JSEN.2021.3083961 10.1109/JSEN.2019.2896910 10.1364/OE.20.002967 10.3390/s18124120 10.1063/1.5128285 10.1016/j.measurement.2018.07.068 10.3390/s19010055 10.1117/12.720914 10.1109/JSEN.2020.3004280 10.3390/s17102368 |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 |
DBID | 97E RIA RIE AAYXX CITATION 7SP 7U5 8FD L7M |
DOI | 10.1109/JSEN.2021.3133704 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998-Present IEEE Electronic Library Online CrossRef Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace |
DatabaseTitle | CrossRef Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
DatabaseTitleList | Solid State and Superconductivity Abstracts |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: http://ieeexplore.ieee.org/Xplore/DynWel.jsp sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Geography Engineering |
EISSN | 1558-1748 |
EndPage | 1345 |
ExternalDocumentID | 10_1109_JSEN_2021_3133704 9641851 |
Genre | orig-research |
GrantInformation_xml | – fundername: University of Naples “Parthenope” through the “Progetto DORA-CUP I26C18000090005.” |
GroupedDBID | -~X 0R~ 29I 4.4 5GY 6IK 97E AAJGR AASAJ ABQJQ ACGFO ACGFS ACIWK AENEX AJQPL AKJIK ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 EBS F5P HZ~ IFIPE IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RIG RNS TWZ AAYXX CITATION 7SP 7U5 8FD L7M |
ID | FETCH-LOGICAL-c293t-41b0275865b52514c7ff7fa26c43596c0a42e00c4721d8afd44596f238520ed83 |
IEDL.DBID | RIE |
ISSN | 1530-437X |
IngestDate | Thu Oct 10 15:26:10 EDT 2024 Fri Aug 23 02:27:37 EDT 2024 Mon Nov 04 11:50:13 EST 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 2 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c293t-41b0275865b52514c7ff7fa26c43596c0a42e00c4721d8afd44596f238520ed83 |
ORCID | 0000-0001-9757-8228 0000-0002-2987-9122 0000-0002-3540-7316 0000-0003-4975-2775 |
PQID | 2619024185 |
PQPubID | 75733 |
PageCount | 8 |
ParticipantIDs | proquest_journals_2619024185 crossref_primary_10_1109_JSEN_2021_3133704 ieee_primary_9641851 |
PublicationCentury | 2000 |
PublicationDate | 2022-01-15 |
PublicationDateYYYYMMDD | 2022-01-15 |
PublicationDate_xml | – month: 01 year: 2022 text: 2022-01-15 day: 15 |
PublicationDecade | 2020 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE sensors journal |
PublicationTitleAbbrev | JSEN |
PublicationYear | 2022 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref13 ref12 ref15 ref14 ref20 ref11 ref10 ref21 ref2 ref1 ref17 ref16 ref19 ref18 ref8 ref7 ref9 ref4 ref3 ref6 ref5 |
References_xml | – ident: ref8 doi: 10.1364/OL.40.001468 – ident: ref9 doi: 10.1038/srep17415 – ident: ref6 doi: 10.1109/JLT.2017.2764951 – ident: ref4 doi: 10.1016/j.optlaseng.2020.106508 – ident: ref1 doi: 10.1007/s13320-020-0579-0 – ident: ref19 doi: 10.1016/B978-0-12-819535-2.00010-7 – ident: ref7 doi: 10.1364/OE.24.025211 – ident: ref12 doi: 10.1088/2040-8978/18/8/085705 – ident: ref13 doi: 10.1364/OL.39.003508 – ident: ref15 doi: 10.1109/JSEN.2016.2584141 – ident: ref14 doi: 10.1016/j.yofte.2016.09.008 – ident: ref18 doi: 10.1109/JSEN.2021.3083961 – ident: ref3 doi: 10.1109/JSEN.2019.2896910 – ident: ref10 doi: 10.1364/OE.20.002967 – ident: ref21 doi: 10.3390/s18124120 – ident: ref2 doi: 10.1063/1.5128285 – ident: ref5 doi: 10.1016/j.measurement.2018.07.068 – ident: ref16 doi: 10.3390/s19010055 – ident: ref11 doi: 10.1117/12.720914 – ident: ref17 doi: 10.1109/JSEN.2020.3004280 – ident: ref20 doi: 10.3390/s17102368 |
SSID | ssj0019757 |
Score | 2.4583275 |
Snippet | In this work, the advantages of 3D printing technology are combined with fiber Bragg grating (FBG) sensors to implement an innovative 3D shape sensor embedded... |
SourceID | proquest crossref ieee |
SourceType | Aggregation Database Publisher |
StartPage | 1338 |
SubjectTerms | 3D printing Biomedical measurement Bragg gratings Curvature Curvature sensor fiber Bragg gratings Fiber gratings Mathematical models Optical fiber sensors Position measurement Sensors Shape shape measurement Strain structural monitoring Three dimensional printing Three-dimensional displays |
Title | 3D Shape Sensing With FBG-Based Patch: From the Idea to the Device |
URI | https://ieeexplore.ieee.org/document/9641851 https://www.proquest.com/docview/2619024185 |
Volume | 22 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV09T8MwELVoF2DgowVRKMgDE8LUcZw4ZqO0pTBUSAXRLUqcM2Wgrdp04N9zTtMKCRY2Kx9S9GzfvZfz3RFyyVMOuBYsEwYsk5YrloZWMJMkOtDcqNA6odgfqsEo6nRdmZzrTS4MABSHz-DGDYtYfjY1S_errKVDV2oFtU5F6WiVq7WJGGhVVPXEDcyZ9NWojGB6XLeeht0BKkHhoUD1fVX2ZFv7oKKpyi9LXLiX3v7_PuyA7JU0kt6t5v2QbMGkRnZ_FBeske2yv_n4q07afocOx8kM6NAdWJ-807ePfEx77QfWRjeW0We0yONb2ptPPylSQvqYQULzaTHugLMmR-S1132577OyewIz6MJzJr3UhSSjMEgDJDHSKGuVTURokCHp0PBECuDcSNSAWZTYTEq8bNGFB4JDFvnHpDqZTuCEUECeFtnU97xQyAztkoyktFKLyAsBfNMgV2s849mqSEZciAuuYwd-7MCPS_AbpO4A3DxYYtcgzfUMxOU2WsRO3iGJwPunf791RnaEy0fgHvOCJqnm8yWck8oiW14Uy-Mb1iuy1A |
link.rule.ids | 315,782,786,798,27933,27934,54767 |
linkProvider | IEEE |
linkToHtml | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1Nj9MwEB2xy6G7B2DbRVvYZX3ghDB1HMdOuNFtSwulQmoRvUWJMyZ72Lbqx4F_zzhNKyT2ws3KhxQ92zPvZTwzAG9FLpDWguPSouPKCcNz7SS3WZZEibBGOy8Uh1Mzmce9vi-T8_6YC4OI1eEz_OCHVSy_WNqd_1XWSbQvtUJa52mkjDb7bK1jzCAxVV1P2sKCq9DM6xhmIJLOl2l_QlpQBiRRw9DUXdkOXqhqq_KPLa4czOD5_33aC3hWE0n2aT_zF_AEF004_6u8YBMadYfz8ncLumGPTctshWzqj6wvfrGf99uSDbqfeZccWcG-k00uP7LBevnAiBSyUYEZ2y6rcQ-9PbmEH4P-7G7I6_4J3JIT33IV5D4oGesoj4jGKGucMy6T2hJHSrQVmZIohFWkAos4c4VSdNmRE4-kwCIOX8LpYrnAK2BITC12eRgEWqqCLJOKlXIqkXGgEUPbhncHPNPVvkxGWskLkaQe_NSDn9bgt6HlATw-WGPXhuvDDKT1RtqkXuARjaD7rx5_6xYaw9m3cToeTb6-hjPpsxNEwIPoGk636x3ewMmm2L2plsofdZK2JQ |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=3D+Shape+Sensing+With+FBG-Based+Patch%3A+From+the+Idea+to+the+Device&rft.jtitle=IEEE+sensors+journal&rft.au=Di+Palma%2C+Pasquale&rft.au=De+Vita%2C+Elena&rft.au=Iadicicco%2C+Agostino&rft.au=Campopiano%2C+Stefania&rft.date=2022-01-15&rft.pub=IEEE&rft.issn=1530-437X&rft.volume=22&rft.issue=2&rft.spage=1338&rft.epage=1345&rft_id=info:doi/10.1109%2FJSEN.2021.3133704&rft.externalDocID=9641851 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1530-437X&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1530-437X&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1530-437X&client=summon |