Structure and mechanical properties of Ag–Cu films prepared by vacuum codeposition of Au and Cu

• Published in: Inorganic materials Vol. 51; no. 7; pp. 673 - 678
• Main Authors: Kushchev, S. B., Bosykh, M. A., Kannykin, S. V., Kostyuchenko, A. V., Soldatenko, S. A., Antonova, M. S.
• Format: Journal Article
• Language: English
• Published: Moscow Pleiades Publishing 01-07-2015
• Subjects: Chemistry; Chemistry and Materials Science; Industrial Chemistry/Chemical Engineering; Inorganic Chemistry; Materials Science; Transmission Electron Micro; Nanocrystalline Structure; Dislocation Mechanism; Indent Depth; Alloy Thin Film
• ISSN: 0020-1685; 1608-3172
• DOI: 10.1134/S0020168515070092

We have studied in detail the structure formation process in Ag–Cu films in the course of vacuum deposition of the metals, followed by thermal annealing, and compared the hardness values of nanocrystalline Ag, Cu, and Ag–Cu films. Under equivalent deposition conditions, the hardness of the Ag–Cu films produced by codeposition of the metals exceeds that of the Ag and Cu films. The high hardness of the mixedphase Ag–Cu films is due to their amorphous–nanocrystalline structure. We have determined the limiting grain size above which plastic deformation follows a dislocation mechanism.